Modular Charged Particle Beam Layout for Parallel Wafer Processing
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Solution Overview
Problem
Electron beam lithography for semiconductor manufacturing is time-consuming and costly, necessitating faster and more cost-effective processing methods.
Innovation Solution
A modular charged particle beam device system with a vacuum chamber, support members, and electrical couplings for multiple charged particle devices, allowing concurrent processing of substrates using independently controlled charged particle beams.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If electron beam lithography is used to process an entire workpiece, then highly customized variations can be achieved on the semiconductor wafer, but the processing time becomes prohibitively long
Solution Approach 1:
The system divides the workpiece into multiple sections, with each section processed by a separate charged particle device. The support member contains multiple openings that accommodate individual charged particle devices, allowing parallel processing of different substrate sections while maintaining customization capability for each section.
Solution Approach 2:
The invention transitions from single-beam sequential processing to multi-beam parallel processing by adding spatial dimensionality. Multiple charged particle devices operate simultaneously on different sections of the substrate, transforming the processing architecture from one-dimensional sequential to two-dimensional parallel operation.
2Manufacturing precision
If traditional electron beam processing methods are used, then processing precision can be maintained, but the processing cost increases due to time consumption
Solution Approach 1:
By segmenting the processing task across multiple charged particle devices operating in parallel, the total processing time is reduced while maintaining precision through independent control of each device. This segmentation approach lowers operational costs by reducing machine time and energy consumption per unit area.
Solution Approach 2:
The system changes the operational parameters by using multiple devices with independent control capabilities, allowing each device to operate at optimized parameters for its specific section. This enables maintaining high precision while reducing overall processing time and associated costs.
3Productivity
If multiple charged particle devices are used for concurrent processing, then processing speed increases, but the system complexity increases
Solution Approach 1:
The support member serves multiple functions: it provides mechanical support for multiple charged particle devices, maintains precise positioning through vibration isolation, and facilitates parallel processing. This universal component reduces overall system complexity by consolidating multiple functions into a single integrated structure.
Solution Approach 2:
The vibration isolation table acts as an intermediary between the external environment and the sensitive charged particle devices. This mediator component protects all devices from external vibrations simultaneously, simplifying the isolation requirements for each individual device while enabling high-speed parallel processing.
Data Source
AI summary
A processing tool for charged particle processing is described herein. The processing tool has a vacuum chamber, a first support member disposed in an interior of the vacuum chamber, the first support member having a plurality of openings to accept a modular charged particle device through each opening, a second support member disposed in the interior of the vacuum chamber in juxtaposition with the first support member, first and second electrical couplings adjacent to the first and second support members, respectively for connecting to the charged particle devices upon inserting through the respective opening for delivering power and control signals to the modular charged particle devices. Processing systems and methods using such processing tools are also described herein.