Interlocking Modular Beamformer Assembly Without RF Cables

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Solution Overview

Problem

Conventional beamformer designs are costly, time-consuming, and limited by feature size and substrate thickness, requiring extensive manual labor and expensive RF cables, which hinder scalability and assembly efficiency.

Innovation Solution

The use of interlocking modular beamformers with SNAP-RF edge interfaces and additive manufacturing techniques eliminates the need for RF cables, enabling quick assembly and reducing labor costs through snap-fit connections and automated manufacturing processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a large number of channels are integrated into a single fixed beamformer unit, then channel integration capability is improved, but device complexity and difficulty of repair increase

Engineering Contradiction:
Improvechannel integration capabilityVSAvoiddevice complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The beamformer is divided into multiple modular channel units, each handling a specific number of channels (e.g., 4 channels per module). These modules can be independently configured, installed, and repaired, reducing overall system complexity while maintaining high channel integration capability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Each modular beamformer unit is designed with universal interfaces and standardized configurations that allow them to perform the same function across different positions in the array. This multi-functionality enables flexible system configuration and simplifies repair operations by allowing interchangeable modules.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If a large number of channels are integrated into a single fixed beamformer unit, then channel integration capability is improved, but ease of repair deteriorates

Engineering Contradiction:
Improvechannel integration capabilityVSAvoidease of repair
Core Design Contradiction:
Adaptability or versatilityVSEase of repair

Solution Approach 1:

By segmenting the beamformer into independent modular units, each module can be individually tested, removed, and replaced without affecting other channels. This significantly improves ease of repair while maintaining the ability to integrate large numbers of channels through multiple modules.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The modular design allows faulty channel modules to be quickly identified and replaced with备用 (spare) modules, enabling rapid repair operations. The standardized interfaces facilitate quick swapping of modules without requiring complex diagnostic or reconfiguration procedures.

Inventive Principle:
Principle #34Discarding and recovering

3Productivity

If channel capacity is increased to improve productivity, then patient throughput is improved, but device complexity increases

Engineering Contradiction:
Improvepatient throughputVSAvoiddevice complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The system uses multiple independent channel modules that can be configured in parallel to increase overall patient throughput. Each module maintains manageable complexity levels while the aggregate system achieves high productivity through modular scalability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The modular architecture allows the system to dynamically adjust the number of active channel modules based on patient throughput requirements. This dynamic configuration enables the system to scale productivity up or down without permanently increasing device complexity.

Inventive Principle:
Principle #15Dynamics

Data Source

PatentEP3984097B1Interlocking modular beamformer
Publication Date: 2026.05.06 RAYTHEON CO
  • EP3984097B1 patent drawingFigure 1~2
  • EP3984097B1 patent drawingFigure 3
  • EP3984097B1 patent drawingFigure 4

AI summary

An array includes a support structure configured to support columns of beamformer assemblies, and a plurality of beamformer assemblies supported by the support structure. Each beamformer assembly includes at least one beamformer having at least one first beamformer segment and at least one second beamformer segment configured to interconnect with the first beamformer segment.