Modular Ball Grid Array Shielding on Printed Circuit Board
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Solution Overview
Problem
Conventional ball grid arrays on printed circuit boards have irregular patterns and low solder ball density, leading to underutilization of space and the need for custom designs, which are not reusable and require significant human resources for verification.
Innovation Solution
A regulated ball grid array arrangement is implemented using multiple modules with a standardized pattern, where each module includes a specific number of solder balls with only two grounded balls providing shielding for the rest, optimizing space and minimizing the number of grounded balls required.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a conventional irregular arrangement of solder balls is used, then the ball grid array can be customized for different chips, but the usable area of the printed circuit board is under-utilized and the design cannot be repeatedly used
Solution Approach 1:
The ball grid array is divided into multiple modules, where each module contains a standardized pattern of solder balls with specific ground shielding arrangements. This segmentation allows the overall array to be customized by selecting and combining different numbers of modules for different chips, while each module itself maintains a fixed, space-optimized design that can be repeatedly used.
2Adaptability or versatility
If a conventional irregular arrangement of solder balls is used, then custom design can be created, but human resources are required for verifying performance and the design is not reusable
Solution Approach 1:
The invention creates a standardized, reusable module design that can be copied and assembled for different chip configurations. Once the module design is verified, it can be repeatedly used across multiple projects without requiring re-verification, significantly improving productivity while still allowing customization through modular assembly.
3Adaptability or versatility
If solder balls are scattered with low density, then the arrangement can be flexible, but the usable area of the printed circuit board is under-utilized
Solution Approach 1:
Within each module, solder balls are arranged in a fixed, high-density pattern that optimizes space utilization. The ground shielding balls are strategically positioned at specific locations within the module to provide effective shielding while maintaining compact dimensions. This local optimization of density within standardized modules achieves both space efficiency and arrangement flexibility.
Data Source
AI summary
A ball grid array formed on a printed circuit board is provided. The ball grid array includes a first bailout module and a second bailout module. The first bailout module includes a plurality of first solder balls arranged as an array. Two of the first solder balls are grounded, and remaining of the first solder balls are disposed within a shielding area defined by the two grounded first balls. Two among the second solder balls are grounded, and remaining of the second solder balls are disposed within a shielding area of the two grounded second balls. The first and second bailout modules deploy substantially a same bailout arrangement, which is associated with relative positions of the two grounded solder balls and the remaining solder balls that are not grounded in each bailout module.