Modular Biometric Card Inlay with Reconfigurable Lead Frames
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Solution Overview
Problem
Existing fingerprint biometric cards face challenges in flexible electrical connections and adaptability, with fixed pin configurations limiting user flexibility and ease of use.
Innovation Solution
The card design incorporates a modular inlay with a microcontroller, module lead frame, and fingerprint sensor lead frame, along with an antenna and electrical wires, allowing for easy reconfiguration of electrical connections and flexible arrangement, using transparent overlay sheets and a thickness compensation sheet for enhanced protection and adaptability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If fixed pin configurations are used in traditional card designs, then manufacturing is simplified, but adaptability and ease of reconfiguration are reduced
Solution Approach 1:
The card design is divided into multiple independent layers including overlay sheets, antenna carrier sheet, and base sheet, each performing specific functions. This segmentation allows independent optimization of each layer while maintaining overall system adaptability without proportionally increasing complexity.
Solution Approach 2:
The electrical connections are made dynamic and reconfigurable through the use of modular components that can be easily replaced or repositioned. The lead frames and contact elements are designed to accommodate different pin configurations, enabling the system to adapt to various sensor and module requirements without fixed rigid connections.
2Ease of operation
If modular components with easy swapping capability are implemented, then ease of operation is improved, but device complexity increases
Solution Approach 1:
The modular components are pre-configured with standardized interfaces and connection protocols during manufacturing. The lead frames and contact elements are prepared in advance with predefined geometries and electrical pathways, so that end-users or technicians can perform swaps without complex configuration or calibration procedures.
Solution Approach 2:
The card architecture employs universal interfaces and standardized connection methods that work across different sensor types and module configurations. The overlay sheets and lead frames are designed with generic features that accommodate multiple pin configurations, allowing the same base structure to support various operational requirements.
3Reliability
If transparent overlay sheets and thickness compensation sheets are added, then protection and adaptability are enhanced, but manufacturing complexity increases
Solution Approach 1:
Multiple functional layers including transparent overlay sheets, antenna carrier sheets, and thickness compensation sheets are combined into a single integrated card structure through lamination. This merging approach provides comprehensive protection and adaptability while maintaining manufacturing efficiency by processing all layers together in standardized production workflows.
Solution Approach 2:
The transparent overlay sheets and thickness compensation sheets are manufactured with controlled optical and mechanical parameters to ensure transparency, uniform thickness, and proper flexibility. By standardizing these parameters during production, the sheets provide enhanced protection and adaptability without requiring complex custom manufacturing processes for each card.
Data Source
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AI summary
The application provides an inlay for a card. The inlay includes a first transparent overlay sheet, an antenna carrier sheet, a thickness compensation sheet, a second transparent overlay sheet. The inlay also includes a microcontroller, a module lead frame, a finger sensor lead frame, an antenna, and electrical wires. The module lead frame is adapted for being milled and it includes a plurality of first contact pads for contacting a contact module. The finger sensor lead frame is adapted for being milled and it includes a plurality of second contact pads for contacting a fingerprint sensor. The electrical wires are connected to the microcontroller, to the first contact pads, to the second contact pads, and to the antenna.