Modular Board Connector Stiffener Alignment

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Solution Overview

Problem

Existing modular connectors face challenges in maintaining scalability and alignment integrity across large surface mount connectors, particularly under high temperature gradients, due to differences in material expansion coefficients between plastic housings and printed circuit boards.

Innovation Solution

The modular connector system employs stainless steel stiffener plates with rectangular slots that engage pin and receptacle modules in both X and Y directions, providing scalability and alignment stability through alternating projection and recess configurations, which align and secure modules while accommodating thermal expansion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If large surface mount connectors are built from individual modules, then manufacturing ease and cost effectiveness improve, but maintaining alignment integrity and tolerances under high temperature gradients deteriorates

Engineering Contradiction:
Improvemanufacturing easeVSAvoidalignment integrity
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The connector is divided into multiple individual modules that can be manufactured separately and then assembled together. Each module contains a subset of the total contacts, allowing for easier manufacturing and assembly while maintaining alignment through the stiffener structure

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The connector combines plastic housing material with metal stiffener material to create a composite structure. The metal stiffener provides thermal stability and maintains alignment tolerances under temperature gradients, while the plastic housing provides ease of manufacture and cost effectiveness

Inventive Principle:
Principle #40Composite materials

2Strength

If connector housing is molded in one piece, then structural integrity improves, but maintaining tolerances under high temperature gradients deteriorates

Engineering Contradiction:
Improvestructural integrityVSAvoidtolerance maintenance
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

The housing is segmented into multiple modules rather than molded as a single piece. This allows each module to be manufactured with tighter tolerances and provides flexibility in assembly while maintaining overall structural integrity through the stiffener connections

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The housing combines plastic material with integrated metal stiffeners to create a composite structure. The metal stiffeners provide thermal stability and maintain alignment tolerances under temperature gradients, while the plastic provides structural integrity and ease of manufacture

Inventive Principle:
Principle #40Composite materials

3Device complexity

If modules are connected without stiffeners, then device complexity reduces, but alignment stability and thermal expansion mismatch deteriorate

Engineering Contradiction:
Improveconnector structureVSAvoidalignment stability
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

Metal stiffeners are introduced as intermediary elements between the plastic housing modules and the printed circuit boards. These stiffeners mediate the thermal expansion differences between materials and maintain alignment stability, acting as a buffer that prevents direct transmission of thermal stresses

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables flexible and scalable connections, reduces thermal expansion mismatch, and maintains precise alignment and contact integrity across multiple modules, enhancing the reliability and durability of the connector system under varying thermal conditions.

Implementation Method 1

due to differences in material expansion coefficients between plastic housings and printed circuit boards

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS7578707B2Modular board to board connector
Publication Date: 2009.08.25 AMPHENOL CORP
  • US7578707B2 patent drawing
  • US7578707B2 patent drawing
  • US7578707B2 patent drawing

AI summary

A connector assembly has a receptacle module and a pin module that interconnect. Stiffener engagement projections and recesses are provided along the sides of the receptacle and pin modules in an alternating fashion. The recesses are sized and shaped to receive the stiffener engagement projections of a respective neighboring module. Stainless steel elongated stiffener plates removably engage the pin and receptacle modules in both an X-direction and/or a Y-direction. The stiffener plates have slots that extend partly through the plates and align with the stiffener engagement projections and receiving recesses. The slots receive respective ones of the projections of the neighboring pin and receptacle modules.