Modular Bridge Array for Electronic Component Interconnects
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Solution Overview
Problem
Existing computing devices face challenges in achieving high data transfer rates and signal integrity due to limitations in individual connectors between electronic components, which also pose alignment and mechanical stability issues.
Innovation Solution
A device comprising a frame member, connecting member, and array bracket forms a connection module that physically and electrically connects electronic components, utilizing printed circuit boards to enhance data transfer rates and alignment, and includes electrical ports for common connections, allowing for customizable configurations to bridge various types of components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If individual connectors are used between electronic components, then device complexity is reduced, but data transfer rate and signal integrity deteriorate
Solution Approach 1:
The connector is divided into multiple independent signal pins arranged in parallel, allowing each pin to carry separate data signals. This segmentation enables high-speed data transfer by providing multiple simultaneous communication channels while maintaining the simplicity of individual connector units.
Solution Approach 2:
Multiple signal pins are combined into a single connector assembly that interfaces between two electronic components. This merging allows the connector to handle high data transfer rates by aggregating the bandwidth of multiple pins while presenting a unified connection interface.
2Ease of manufacture
If individual connectors are used between electronic components, then ease of manufacture is improved, but signal integrity deteriorates
Solution Approach 1:
The connector design incorporates standardized signal pins that can serve multiple functions including data transmission, power delivery, and grounding. This multi-functionality maintains ease of manufacture through standardized components while ensuring signal integrity through dedicated signal paths for each function.
Solution Approach 2:
The connector acts as an intermediary component with controlled impedance traces that mediate between the circuit boards and external connections. This intermediary structure preserves signal integrity by providing consistent electrical characteristics while maintaining ease of manufacture through standardized connector designs.
3Device complexity
If individual connectors are used between electronic components, then device complexity is reduced, but alignment precision deteriorates
Solution Approach 1:
The connector incorporates asymmetric features such as keyed slots or offset positioning elements that prevent incorrect orientation and ensure precise alignment during assembly. This asymmetric design maintains simple connection structure while achieving high alignment precision through mechanical guidance features.
Solution Approach 2:
The connector includes pre-positioned alignment pins or guide features that establish correct positioning before the actual connection is made. This preliminary alignment action simplifies the overall connection structure while ensuring precise alignment is achieved before final assembly.
4Ease of operation
If individual connectors are used between electronic components, then ease of operation is improved, but mechanical stability deteriorates
Solution Approach 1:
The connector design features nested structural elements where outer housing components provide mechanical support and protection while inner signal pins provide electrical connection. This nested structure maintains ease of operation for connection while achieving high mechanical stability through layered structural support.
Solution Approach 2:
The connector incorporates locally reinforced structures at critical stress points while maintaining simplicity in non-critical areas. This local quality approach ensures mechanical stability where needed without increasing overall operational complexity, providing stable connections with ease of use.
Data Source
Figure 1A
Figure 1B
Figure 2A~2B
AI summary
A bridge array for connecting electronic components within a housing includes an array bracket and a plurality of connection modules coupled to the array bracket. Each connection module includes a first electrical connector configured to receive a first electronic component, and a second electrical connector configured to receive a second electronic component; thereby physically and electrically connecting the first electronic component and the second electronic component of each connection module. The array bracket includes a first electrical port electrically connected to the first electrical connector of each connection module. The first electrical port provides a common connection to the first electronic component of each connection module. The array bracket includes a second electrical port electrically connected to the second electrical connector of each connection module. The second electrical port provides a common connection to the second electronic component of each connection module.