Modular Cable Backplane Assembly for High-Speed Interconnects
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current high-end electronic systems face limitations in handling increasing signal speeds, signal integrity, switching fabric size, FRU/line card densities, cooling, and power distribution, leading to technological obsolescence and costly 'forklift upgrades due to inadequate interconnecting infrastructure.
Innovation Solution
A modular three-dimensional cable backplane assembly with front-to-back airflow, enabling field replacement and upgrade from copper to fiber optics, providing high-speed interconnects, adaptive scaling, and improved cooling and power distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional PCB technology is used for fixed backplanes, then system interconnection is achieved, but signal integrity deteriorates at high speeds (25 Gbps limit)
Solution Approach 1:
The patent replaces conventional PCB mechanical/electrical interconnection with a cable-based interconnection system. The cable backplane assembly uses flexible cables with connectors to establish electrical connections between FRUs, substituting the rigid PCB trace mechanism. This substitution enables higher signal speeds while maintaining signal integrity, as cables can be optimized for high-frequency performance unlike conventional PCB materials.
Solution Approach 2:
The patent changes the physical and material parameters of the interconnection medium from PCB dielectric materials (like Megtron 6) to cable assemblies with controlled impedance conductors and shielding. This parameter change allows the system to achieve speeds beyond 25 Gbps while maintaining signal integrity through proper cable design, connector selection, and impedance matching.
2Productivity
If more FRUs are densely packed in the rack, then system capacity increases, but cooling and power distribution become inadequate
Solution Approach 1:
The patent transitions from a two-dimensional FRU arrangement on a flat PCB backplane to a three-dimensional cable-based interconnection system. The cable backplane assembly allows FRUs to be vertically stacked with cables routing connections through the rack depth, enabling denser packing while maintaining proper airflow channels for cooling from front to back of the rack.
Solution Approach 2:
The patent segments the interconnection function from the cooling function. The cable backplane assembly separates electrical interconnection (handled by cables) from thermal management (handled by dedicated cooling airflow paths). This segmentation allows independent optimization of both functions, enabling higher FRU density without compromising cooling adequacy.
3Adaptability or versatility
If the system infrastructure is upgraded to accommodate more lanes, then signal capacity increases, but costly forklift upgrades are required
Solution Approach 1:
The patent creates a dynamic, modular interconnection system where the cable backplane assembly can be reconfigured by simply plugging and unplugging cable assemblies. This dynamic design allows the system to adapt to different FRU configurations and signal capacity requirements without requiring complex re-wiring or infrastructure replacement, enabling incremental upgrades rather than forklift upgrades.
Solution Approach 2:
The cable backplane assembly serves multiple functions: electrical interconnection, signal transmission, and physical support for FRUs. The universal connector design and modular cable assemblies can accommodate different FRU types and configurations, providing adaptability for future technology upgrades while maintaining compatibility with existing infrastructure.
4Reliability
If copper connectors are used for high-speed interconnects, then electrical connection is achieved, but signal integrity is compromised at increasing speeds
Solution Approach 1:
The patent employs composite interconnection structures combining copper conductors with shielding materials and specialized connector housings. The cable assemblies use composite construction with copper cores for electrical conductivity, surrounded by shielding layers for signal integrity, and enclosed in protective jackets. This composite approach maintains signal integrity at high speeds by reducing electromagnetic interference and signal loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves high signal counts with optimal signal integrity, avoids costly upgrades, and future-proofs systems by enabling modular upgrades and increased density, reducing downtime and costs while accommodating evolving technologies.
Implementation Method 1
mounting points for a plurality of cooling fans aligned with each of the plurality of cable connector carrying trays to provide front-to-back cooling airflow
Data Source
AI summary
A modular cable backplane assembly for high-speed interconnection of digital electrical components in Field Replaceable Units, FRUs, (12) mounted in an equipment rack (10). A vertical stack of a plurality of parallel horizontal cable connector carrying trays (51) is mounted within a rigid chassis (32). The trays provide electrical component connector pins on a front side and high-speed data and power cable connectors on a back side thereof. At least one enclosed vertical channel (21) is attached to the vertical stack of horizontal plates (51) for protectively routing cables to the cable connector carrying trays. Vertical spacing of the cable connector carrying trays enables cooling fans (41) mounted on the rigid chassis to provide unimpeded front-to-back airflow over the FRUs (12). The cable backplane assembly may be removed and replaced as a unit, and may be upgraded, in situ, from copper to optical connections.