Modular Carrier Damping for Downhole Electronic Assemblies
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Solution Overview
Problem
Conventional packaging methods for downhole electronic modules in the oil and gas industry, such as potting and wet-mounting, are prone to damage during manufacturing and maintenance, leading to increased failure rates and complex removal processes, while edge rail structures lack adequate strength and mechanical damping.
Innovation Solution
A modular carrier with top and bottom rails and damping pads is used to secure circuit boards, providing a robust and rigid structure that prevents flexure and allows for easy access and replacement, reducing manufacturing costs and enhancing high-temperature integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If circuit boards are clamped into a simple edge rail structure, then the device complexity is reduced, but the strength and mechanical dampening are insufficient to properly retain electronic components
Solution Approach 1:
The packaging structure is divided into modular components: a rigid support structure with multiple rails, separate damping elements, and individual circuit board mounting positions. This segmentation allows each component to perform its specific function optimally while maintaining overall structural integrity and enabling easy assembly/disassembly.
Solution Approach 2:
The packaging structure combines rigid materials (for the support structure and rails) with damping materials (for vibration isolation). This composite approach provides both the necessary mechanical strength to retain electronic components and the required vibration dampening properties.
2Reliability
If electronic modules are potted in foam or silicone, then protection from harsh downhole environments is improved, but manufacturing and field maintenance problems increase due to wire movement and component stress
Solution Approach 1:
The electronic modules are extracted from the problematic potting process entirely. Instead of embedding components in curing foam or silicone, the design uses a rigid support structure with damping elements that provide protection without the adverse effects of potting, such as wire movement and component stress.
Solution Approach 2:
Damping pads or damping elements are introduced as intermediary components between the rigid support structure and the circuit boards. These intermediaries provide vibration isolation and shock protection without the harmful effects of potting materials, allowing easy manufacturing and maintenance.
3Reliability
If electronic modules are wet-mounted in downhole tools, then downhole environment withstand capability is improved, but permanent damage results from aggressive removal procedures
Solution Approach 1:
The assembly is segmented into separable components: the downhole tool, the rigid support structure, and the circuit boards. This segmentation allows the circuit boards to be easily removed from the rigid support structure for repair or replacement without damaging the downhole tool or the electronic components.
Solution Approach 2:
The mounting system transitions from a permanent, aggressive wet-mount configuration to a dynamic, reversible arrangement using the rigid support structure with damping elements. This allows the electronic modules to be securely mounted during operation but easily removed when maintenance is needed.
4Device complexity
If circuit boards act as primary support structures, then the device complexity is reduced, but adequate strength, stiffness, and mechanical dampening losses are not provided to properly retain electronic components
Solution Approach 1:
Damping pads are introduced as intermediary elements between the circuit boards and the rigid support structure. These damping pads provide the necessary mechanical dampening losses and vibration isolation, while the rigid support structure provides the primary strength and stiffness. This intermediary layer ensures proper retention of electronic components without requiring the circuit boards to bear all mechanical loads.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modular carrier system reduces the risk of damage during manufacturing and maintenance, lowers scrap rates, and improves the reliability and reparability of downhole electronic assemblies, while also providing effective vibration damping and thermal management.
Implementation Method 1
a damping pad that interposes the module carrier and a host downhole tool when installed
Implementation Method 2
enhancing high-temperature integrity
Data Source
AI summary
Downhole electronics assemblies including a modular carrier including a top rail and a bottom rail, the top and bottom rails each including a pair of longitudinally extending sides and the top rail providing one or more ribs that extend between the longitudinally extending sides of the top rail. A circuit board is positionable between the top and bottom rails and has a top side and a bottom side and one or more electronic components mounted on at least one of the top and bottom sides. One or more damping pads interpose the circuit board and a host downhole tool such that contact between the circuit board and the host downhole tool is prevented.