Modular Electronics Chassis for Interchangeable Air and Liquid Cooling
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Solution Overview
Problem
Current chassis designs are not adaptable to function in either forced air conduction cooling or liquid conduction cooling modes, leading to operational disruptions when a compatible chassis is not available, resulting in downtime for vehicles or systems.
Innovation Solution
A modular electronics chassis with dual fluid flow paths and interchangeable components for both cooling modes, featuring sealed fluid flow paths and detachable fluid control couplings and fan assemblies to facilitate seamless switching between forced air and liquid conduction cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a chassis is designed for a specific cooling mode (forced air or liquid), then cooling performance is optimized, but adaptability to different cooling modes is lost
Solution Approach 1:
The chassis is designed with universal mounting interfaces and standardized fluid flow paths that can accommodate both forced air cooling components (fans, air filters) and liquid cooling components (coolant couplings, hoses). The frame includes interchangeable mounting structures that allow the same chassis to perform multiple cooling functions without requiring redesign or additional chassis units.
2Adaptability or versatility
If multiple chassis configurations are maintained for different cooling modes, then adaptability is improved, but device complexity and inventory requirements increase
Solution Approach 1:
The cooling system is segmented into modular, interchangeable components that can be independently attached or detached from the chassis. Forced air cooling components (fans, air filters) and liquid cooling components (coolant couplings) are designed as separate modules that mount to standardized interfaces on the chassis frame, allowing flexible configuration without complex integrated designs.
3Temperature
If a chassis is replaced when cooling mode requirements change, then cooling performance is maintained, but downtime increases
Solution Approach 1:
The chassis cooling system is designed with dynamic reconfigurability, allowing users to switch between forced air and liquid cooling modes by simply detaching and attaching different modular components to the same chassis frame. This dynamic adaptation eliminates the need for chassis replacement and enables quick transitions in response to changing cooling requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the chassis to efficiently dissipate heat in either cooling mode, minimizing downtime by allowing quick adaptation to different cooling methods without the need for multiple chassis configurations, thus ensuring continuous operation.
Implementation Method 1
One known method is forced air conduction cooling in which a fan or blower is used to force air through channels in the chassis walls
Implementation Method 2
Another method is known as liquid conduction cooling. In this method a pressurized coolant flows through one or more conduits associated with the chassis to dissipate heat
Data Source
AI summary
An electronics chassis comprises a frame including at least one fluid flow path along a side of the frame and that is sealed relative to an interior volume of the frame. A first opening to the fluid flow path is at a first end of the frame; and, a second opening to the fluid flow path at a second end of the frame. The first and second ends of the frame are configured to interchangeably receive components for forced air conduction cooling and components for liquid conduction cooling through the fluid flow paths.