Modular Electronics Chassis Ejection Mechanism
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Solution Overview
Problem
Existing methods for mounting modular electronic devices in chassis are complex and time-consuming, and vibrations can cause screws to loosen, leading to damage, with issues of decoupling and ejection forces not adequately addressed in carrierless solutions.
Innovation Solution
An apparatus and method featuring a door pivotally coupled to the chassis with first and second ejection actuators, a sliding element, and a linkage element, along with a guide rail, to facilitate the removal of modular electronic devices by decoupling and ejecting them from the chassis using independent forces, ensuring safe and efficient removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If screws are used to mount modular electronic devices to provide alignment and bearing surface, then the device can be securely mounted, but the mounting becomes complex and time-consuming, and vibrations can cause screws to loosen leading to damage
Solution Approach 1:
The patent removes the carrier entirely from the mounting system, extracting the problematic screw-based attachment mechanism. The modular electronic device is mounted directly into the chassis enclosure using guide rails and ejection actuators, eliminating screws and their associated complexity and vibration-related loosening issues while maintaining secure mounting through the ejection actuator mechanism
Solution Approach 2:
The patent introduces guide rails as an intermediary element between the modular electronic device and the chassis enclosure. These guide rails provide alignment and bearing surfaces without requiring screw fasteners, mediating the mounting function while reducing complexity and vibration sensitivity
2Device complexity
If carrierless solutions are used to simplify mounting, then mounting complexity is reduced, but issues of decoupling the modular electronic device from the connector and managing ejection forces are not adequately addressed
Solution Approach 1:
The patent segments the ejection function into two independent actuators: a first ejection actuator for decoupling the modular electronic device from the connector, and a second ejection actuator for ejecting the device from the chassis enclosure. This segmentation allows each actuator to be optimized for its specific function, ensuring reliable decoupling and ejection while maintaining mounting simplicity
Solution Approach 2:
The patent performs preliminary decoupling of the modular electronic device from the connector before the main ejection from the chassis enclosure. The first ejection actuator disconnects the device from electrical and mechanical connectors in advance, preventing damage during the subsequent ejection process and ensuring reliable operation
3Device complexity
If a single ejection mechanism is used, then the device structure is simpler, but independent control of decoupling and ejection forces cannot be achieved
Solution Approach 1:
The patent divides the ejection mechanism into two separate actuators positioned at different locations within the chassis enclosure. The first ejection actuator is dedicated to decoupling operations, while the second ejection actuator handles the main ejection force. This segmentation enables independent control of decoupling and ejection forces, providing adaptability for different mounting scenarios while keeping each individual actuator relatively simple
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution simplifies the removal process, reduces the risk of damage from vibrations, and allows for easy assembly and disassembly of modular electronic devices, addressing the complexities and inefficiencies of existing methods.
Implementation Method 1
The second ejection actuator may include a spring member. The spring member may be connected to the second ejection actuator and to the rear of the chassis.
Data Source
AI summary
An apparatus for removing a modular electronic device from a chassis and a method for assembling thereof are provided. The apparatus for removing the modular electronic device from the chassis comprises a door pivotally coupled to the chassis, a sliding element in slidable engagement with the door, a first ejection actuator coupled to the door and configured to move simultaneously with the door, a second ejection actuator including a spring member connected to the second ejection actuator and to the rear of the chassis, and a linkage element connecting the sliding element with the second ejection actuator. Additionally, the apparatus for removing the modular electronic device from the chassis comprises a guide rail disposed in the chassis enclosure to guide the modular electronic device and to guide the second ejection actuator along the chassis enclosure.