Modular Electronics Chassis Ejection Mechanism
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Solution Overview
Problem
Existing methods for mounting modular electronic devices in a chassis are complex and time-consuming, and vibrations can cause screws to loosen, leading to damage, while also failing to address issues of decoupling and ejection forces.
Innovation Solution
An apparatus with a pivotally coupled door, a sliding element, an ejection actuator with a spring member, and a linkage element, along with guide rails, facilitates the removal of modular electronic devices by decoupling them from connectors and guiding them out of the chassis enclosure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If screws are used to attach carrier to electronic equipment, then alignment and bearing surface are provided, but the mounting process becomes complex and time-consuming
Solution Approach 1:
The patent removes the carrier component entirely from the modular electronic device assembly. The device is mounted directly into the chassis enclosure without requiring a separate carrier, thereby eliminating the complexity of attaching and aligning carriers while maintaining proper positioning through the chassis structure itself
Solution Approach 2:
The patent divides the mounting system into discrete modular components that can be independently assembled. The modular electronic device consists of separate functional modules that can be independently installed and removed from the chassis, simplifying the overall mounting process
2Strength
If screws are used to mount modular electronic device, then secure attachment is achieved, but vibrations cause screws to loosen and lead to damage
Solution Approach 1:
The patent eliminates screws and fastening hardware from the mounting system. Instead of using threaded fasteners that can loosen under vibration, the device is retained in the chassis through friction-fit engagement and mechanical interference of the mounting surfaces, which are inherently resistant to vibrational loosening
Solution Approach 2:
The patent employs mounting surfaces that accommodate slight movements and adjustments through elastic deformation and frictional engagement. The contact surfaces are designed to maintain secure attachment through normal operational forces while allowing for thermal expansion and minor positional adjustments without requiring rigid fixed-point fastening
3Manufacturing precision
If carrierless solution is used, then alignment is improved, but issues of decoupling and ejection forces are not addressed
Solution Approach 1:
The patent incorporates pre-designed decoupling mechanisms and ejection features into the modular device structure. Release latches and ejection ribs are built into the device housing before assembly, enabling easy decoupling from the chassis without requiring complex tools or procedures, while maintaining precise alignment during operation
Solution Approach 2:
The patent introduces intermediary decoupling elements such as release latches and engagement ribs that mediate between the modular device and chassis. These intermediaries facilitate easy separation and reattachment while maintaining secure connection during normal operation, solving both the alignment precision and ease of decoupling requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the removal process, reduces the risk of damage from vibrations, and effectively manages ejection forces, making it easier and safer to remove and install modular electronic devices.
Implementation Method 1
The ejection actuator may include a spring member. The spring member may be connected to the ejection actuator and to the rear of the chassis.
Data Source
AI summary
An apparatus for removing a modular electronic device from a chassis and a method for assembling thereof are provided. The apparatus for removing the modular electronic device from the chassis includes a door pivotally coupled to the chassis, a sliding element in slidable engagement with the door, an ejection actuator including a spring member connected to the ejection actuator and to the rear of the chassis, and a linkage element connecting the sliding element with the ejection actuator. Additionally, the apparatus for removing the modular electronic device from the chassis includes a guide rail disposed in the chassis enclosure to guide the modular electronic device and to guide the ejection actuator along the chassis enclosure.