Modular Chassis Power Distribution Segmentation
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Solution Overview
Problem
The existing modular packet switch/router designs face challenges in scaling due to thick copper power planes, which complicate dielectric filling, increase board thickness, and lead to inefficiencies in cooling and redundancy, particularly with DC/DC power converters being placed after logic components, leading to potential shutdowns and difficult maintenance.
Innovation Solution
A novel power distribution design where power conversion cards are placed behind the backplane, generating logic voltages and allowing the removal of thick power planes from the backplane, with separate cooling for power conversion cards and logic cards, and sharing mechanisms for redundancy and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If thick copper power planes are used to distribute primary power, then power distribution capability is improved, but board thickness increases and dielectric filling becomes complicated
Solution Approach 1:
The power distribution function is segmented from the signaling backplane and placed on separate power conversion cards. This segmentation allows the backplane to use thin power planes for signaling while power conversion cards handle high-current power distribution, eliminating the need for thick copper planes in the backplane and simplifying dielectric filling.
2Area of stationary object
If DC/DC power converters are placed after logic components in the cooling airflow path, then space utilization is improved, but cooling efficiency deteriorates and shutdown risk increases
Solution Approach 1:
Instead of placing power converters after logic components in the cooling airflow path, the invention inverts the arrangement by placing power conversion cards in front of the backplane where they receive cooler air first. This ensures power converters are cooled efficiently before they can overheat and shut down, while logic components on the backplane receive the already-warmed air.
3Temperature
If power conversion cards are placed behind the backplane, then cooling efficiency is improved, but access for maintenance becomes difficult
Solution Approach 1:
Power conversion cards are extracted from the traditional behind-backplane location and placed in front of the backplane. This extraction improves maintenance accessibility while maintaining cooling efficiency through separate cooling airflows that can be routed independently of the logic component cooling paths.
4Temperature
If separate cooling systems are implemented for power conversion cards and logic cards, then cooling efficiency is improved, but system complexity increases
Solution Approach 1:
The cooling system is segmented into separate airflow paths for power conversion cards and logic cards. This segmentation allows independent optimization of cooling for each component type while maintaining modular architecture that simplifies overall system management and maintenance.
Data Source
AI summary
A modular packet network device has a chassis in which multiple logic cards mate to the front side of an electrical signaling backplane. Logic power for the logic cards is supplied from a group of power converter cards that convert primary power to the logic voltages required by the logic cards. The power converter cards lie in a separate cooling path behind the backplane. Advantages achieved in at least some of the embodiments include removing primary power planes from the signaling backplane or portion of the backplane, providing redundant, upgradeable power modules whose individual failure does not cause logic card failure, and providing cool air to power converter circuits that would be subject to only heated air if located on the logic cards. Other embodiments are also described and claimed.