Modular Optoelectronic Chip Package With Interchangeable Optical Adapter
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Solution Overview
Problem
The existing photovoltaic power converters require multiple packages due to varying applications needing different optical coupling and electrical interfaces, leading to increased manufacturing complexity and stock requirements.
Innovation Solution
A modular package for an optoelectronic chip assembly featuring a back wall, basic body, adapter, chip seat, and electrical interface, allowing interchangeable adapters for optical fibers and standardized electrical connections, with enhanced thermal management through thermal contact between the back wall and basic body.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple different packages are used to address different applications with varying optical coupling and electrical interfaces, then application versatility is improved, but device complexity and manufacturing stock requirements worsen
Solution Approach 1:
The patent implements a universal package platform with standardized mechanical interface, electrical interface, and thermal management components that can accommodate different optoelectronic chip assemblies for various applications. The standardized cavity dimensions, electrical contact arrangements, and thermal pathways allow a single package design to serve multiple applications while maintaining performance requirements.
Solution Approach 2:
The package is divided into distinct functional modules including the basic body forming the cavity, the adapter for optical coupling, the electrical interface with separate contact elements, and the thermal management components. This segmentation allows each module to be optimized independently while maintaining compatibility with the standardized platform.
2Ease of manufacture
If standardized electrical interface is implemented, then ease of manufacture and system integration are improved, but adaptability to different applications may worsen
Solution Approach 1:
The standardized electrical interface with defined contact patterns and connection methods enables uniform manufacturing processes and simplified system integration across different applications. The universal interface design allows automated assembly while the modular nature permits customization for specific application requirements through configuration rather than redesign.
Solution Approach 2:
The electrical interface parameters such as contact resistance, connection geometry, and signal routing can be adjusted within the standardized framework to meet different application requirements. This allows the same basic interface structure to serve multiple applications by varying electrical parameters rather than requiring completely different interface designs.
3Temperature
If thermal contact between back wall and basic body is enhanced, then thermal management is improved, but device complexity worsens
Solution Approach 1:
The back wall and basic body are integrated with direct thermal contact, merging the structural support function with the thermal management function into a unified design. This integration eliminates the need for separate thermal pathways or additional thermal interface components, reducing overall device complexity while achieving effective heat dissipation.
Solution Approach 2:
The back wall and basic body structure serves dual purposes: providing mechanical support and enabling thermal management through inherent thermal contact. This multi-functionality approach allows the same structural elements to fulfill both structural and thermal roles, avoiding additional complexity from dedicated thermal management components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a versatile package that can address multiple applications with reduced parts, enabling standardized integration into larger electronics systems while ensuring effective thermal management and protection against environmental factors.
Implementation Method 1
the back wall and the basic body are in thermal contact with each other; wherein the back wall or the basic body is thermally conductive acting as a heat dissipator for cooling of the optoelectronic chip assembly
Implementation Method 2
the opening allows electromagnetic radiation to enter or exit the cavity
Implementation Method 3
the adapter supports at least a light guiding means or a receptacle for an optical fiber connector; wherein the adapter is interchangeably mounted on the mechanical interface such that during the operation of the package light guided by the light guiding means or through the optical fiber connector enters the cavity through the opening
Data Source
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AI summary
The present invention relates to a package for an optoelectronic chip assembly According to the invention the package comprises: a back wall; a basic body, wherein the basic body comprises an opening and a mechanical interface; wherein the back wall and the basic body form a cavity; an adapter, wherein the adapter supports at least a light guiding means or a receptacle for an optical fiber connector; a chip seat to accommodate the optoelectronic chip assembly; and an electrical interface comprising a plurality of chip contacts, a plurality of access contacts and a plurality of connections, wherein the plurality of chip contacts is arranged such that during an operation of the package an optoelectronic chip assembly accommodated on the chip seat can be contacted to the plurality of chip contacts, wherein the plurality of access contacts is arranged outside the cavity so as to be contactable, and wherein the plurality of connections electrically conductively connects the plurality of chip contacts and the plurality of access contacts; wherein the back wall and the basic body are in thermal contact with each other; wherein the opening allows electromagnetic radiation to enter or exit the cavity; wherein the adapter is interchangeably mounted on the mechanical interface such that during the operation of the package light guided by the light guiding means or through the optical fiber connector enters the cavity through the opening; wherein the chip seat is positioned so that the optoelectronic chip assembly when mounted is located in the cavity; wherein the plurality of chip contacts is located in the cavity; and wherein the back wall or the basic body is thermally conductive acting as a heat dissipator for cooling of the optoelectronic chip assembly when accommodated on the chip seat.