Modular Electronic Chip Test Device for High Temperature and Humidity
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Solution Overview
Problem
Current electronic chip testing devices require numerous manipulations, leading to high costs and a risk of failures, especially when testing at high temperatures or with humidity, as they necessitate transferring chips between different test supports, which can cause chipping, breakage, or damage.
Innovation Solution
A modular electronic chip testing device comprising a first and second part, assembled in a removable manner, allowing the chip to be tested in multiple positions without direct handling, using a support system that can withstand high temperatures and humidity, with a base and cover applying force to the chip through pivoting arms and electrical contactors for secure testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic chips are transferred between different test supports for different test phases, then different test conditions can be applied, but the risk of chip damage and manipulation costs increase
Solution Approach 1:
The test support is designed with a removable first part that can be configured in different positions to accommodate various test conditions. The support structure includes a first portion and a second portion that can be selectively removed or repositioned, allowing the same support to function for multiple test phases (electrical testing, high temperature testing, humidity testing) without requiring chip transfer between different supports.
Solution Approach 2:
The test support incorporates a dynamic configuration where the first part can be removed and repositioned based on test requirements. This dynamic reconfiguration allows the support to adapt to different test conditions while maintaining continuous chip containment, eliminating the need for chip manipulation between test phases.
2Productivity
If electronic chips are directly manipulated for different test phases, then testing can be performed, but the cost and risk of failures increase
Solution Approach 1:
The chip is initially placed in the test support before any testing begins. The support is pre-configured with the first part in position, and the chip remains contained throughout all test phases. This preliminary positioning eliminates the need for subsequent chip manipulation, as all test conditions can be applied by reconfiguring the support rather than moving the chip.
Solution Approach 2:
The test support acts as an intermediary between the chip and various test conditions. Instead of directly manipulating the chip for different tests, the support mediates by providing different configurations (with first part present or removed) to enable electrical testing, high temperature testing, and humidity testing while the chip remains stationary and protected.
3Adaptability or versatility
If the first part of the housing is removed for certain tests, then high temperature and humidity tests can be applied, but the chip may be damaged without proper positioning
Solution Approach 1:
The test support provides different local configurations based on test requirements. When high temperature or humidity testing is required, the first part is removed to allow environmental exposure. When electrical testing is required, the first part is in place to provide protection and electrical contact. This local quality variation enables appropriate test conditions while protecting the chip from damage.
Solution Approach 2:
Before removing the first part for high temperature or humidity testing, the support is pre-configured with the second portion in the correct position to provide necessary support and protection to the chip. This preliminary arrangement ensures that when the first part is removed, the chip is already positioned to withstand the harsh test conditions without damage.
Data Source
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AI summary
This description relates to a test device (11) for electronic chips (P) comprising a first part (11a) and a second part (11b), which can be assembled together in a detachable manner and adapted to define between them at least one housing (110) in which at least one electronic chip (P), including contact elements, can be arranged for testing; said at least one housing (110) comprising a first portion (110a) and being arranged to allow said at least one electronic chip (P) to occupy a first position (Pa) in said housing (110), in which a first face (Pc) of said electronic chip (P) is away from the first portion (110a), and a second position (Pb) in said housing (110), in which the first face (Pc) is in contact with the first portion (110a).