Modular Chip Voltage Islands for Heterogeneous Integration
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Solution Overview
Problem
The modular chip fabrication process faces compatibility issues due to changes in chip technology, leading to incompatibilities between 'old' and 'new' technologies, particularly in power requirements, limiting the versatility of current design technology unless all components are redesigned for the latest node.
Innovation Solution
A modular chip structure and fabrication method that includes a substrate, a carrier platform with conductive vias and a wiring layer configured to divide into voltage islands, allowing integration of pre-designed chip circuits and macros from different semiconductor nodes, enabling heterogeneous chip technology integration and reducing power requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If chip technology is scaled down to smaller feature sizes, then functionality and power efficiency are improved, but compatibility with existing components deteriorates
Solution Approach 1:
The chip is divided into multiple voltage islands, each capable of operating at different voltage levels. This segmentation allows different components to operate at their optimal voltage levels while being integrated on the same chip, resolving the compatibility issue between old and new technologies
Solution Approach 2:
Different regions of the chip (voltage islands) are assigned different electrical properties (voltage levels) according to the specific requirements of components in each region. This allows heterogeneous technologies with different power requirements to coexist on the same chip
2Adaptability or versatility
If all components are redesigned for the latest node, then compatibility is improved, but design complexity and fabrication cost increase
Solution Approach 1:
Instead of redesigning all components, the chip is segmented into voltage islands that allow legacy components to operate at their original voltage levels while new components operate at scaled-down voltages, avoiding the need for complete redesign
Solution Approach 2:
The voltage island architecture provides a universal platform that can accommodate both old and new technologies with different power requirements, making the fabrication process versatile without requiring component redesign
Data Source
AI summary
Techniques for modular chip fabrication are provided. In one aspect, a modular chip structure is provided. The modular chip structure comprises a substrate; a carrier platform attached to the substrate, the carrier platform comprising a plurality of conductive vias extending through the carrier platform; and a wiring layer on the carrier platform in contact with one or more of the conductive vias, wherein the wiring layer comprises one or more wiring levels and is configured to divide the carrier platform into a plurality of voltage islands; and chips, chip macros or at least one chip in combination with at least one chip macro assembled on the carrier platform.