Modular Electrostatic Chuck Assembly for Crack-Resistant Thermal Control
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Solution Overview
Problem
Traditional electrostatic chucks and heaters for semiconductor wafers are monolithic, leading to increased risk of cracking and limited functionality due to embedded components, requiring replacement of the entire unit upon failure.
Innovation Solution
A modular substrate support assembly composed of multiple puck plates with functional elements, allowing for modular design and adjustment of thermal response by connecting heating elements in series or parallel, and using interface layers for bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a monolithic ceramic body is used for electrostatic chuck or heater, then all functional elements can be embedded within a single body, but the risk of cracking during manufacture and use increases
Solution Approach 1:
The electrostatic chuck or heater is divided into multiple separate ceramic bodies, each containing specific functional elements. This segmentation reduces the complexity of manufacturing a single large monolithic body and decreases the risk of cracking during manufacture and use, as each smaller component can be manufactured and tested independently before assembly.
2Adaptability or versatility
If multiple functional elements are embedded in a single electrostatic chuck or heater, then integration is achieved, but the complexity of the device is limited to minimize cracking
Solution Approach 1:
Different functional elements (electrodes, heating elements, sensors) are distributed across multiple separate ceramic bodies. Each body is manufactured with its specific function, reducing manufacturing complexity for each component while achieving overall functional integration through assembly of the modular system.
Solution Approach 2:
The modular design allows the same ceramic body structure to serve multiple functions by configuring different functional elements in each module. The standardized interface between modules enables universal assembly patterns while accommodating various functional configurations.
3Device complexity
If a monolithic electrostatic chuck or heater is used, then the structure is unified, but the entire unit must be replaced if any functional component fails
Solution Approach 1:
The system is divided into replaceable modular ceramic bodies, each containing specific functional elements. If one functional component fails, only the affected ceramic body module needs to be replaced rather than the entire unit, significantly improving repair efficiency and reducing downtime.
4Ease of manufacture
If the complexity of electrostatic chuck or heater is minimized, then manufacturability is ensured, but adaptability and customization are limited
Solution Approach 1:
The modular architecture allows each ceramic body to be manufactured with standardized processes for specific functions, ensuring ease of manufacture for each component. The system achieves high adaptability through flexible assembly of these standardized modules to create customized configurations for different applications.
Solution Approach 2:
Multiple functional layers and elements are nested within each ceramic body module, with each layer serving a specific function. This nested structure maintains manufacturing simplicity for each module while enabling complex overall system functionality through the combination of nested functional elements across multiple modules.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables quick assembly and customization of substrate supports, reducing the risk of cracking and enhancing thermal control, while allowing for efficient repair and maintenance.
Implementation Method 1
an interface layer at least partially bonding the first puck plate and the second puck plate
Implementation Method 2
A series connection between the first heating electrode and the second heating electrode increases a net resistance for a combination of the first heating electrode and the second heating electrode, and a parallel connection between the first heating electrode and the second heating electrode reduces a net resistance for the combination of the first heating electrode and the second heating electrode
Data Source
AI summary
An electrostatic chuck assembly includes a first puck plate including one or more first functional elements, a second puck plate including one or more second functional elements, and an interface layer at least partially bonding the first puck plate and the second puck plate.