Modular Electrostatic Chuck Assembly for Crack-Resistant Thermal Tuning

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Solution Overview

Problem

Traditional electrostatic chucks and heaters for substrate processing are monolithic, leading to increased risk of cracking and limited functionality due to embedded components, requiring replacement of the entire unit upon failure.

Innovation Solution

A modular substrate support assembly composed of multiple puck plates with functional elements, allowing for customization and adjustment of thermal response by combining and bonding plates with interface layers, enabling fine control of thermal performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a monolithic ceramic body is used to embed all functional elements, then the structural integrity is improved, but the risk of cracking during manufacture and use increases

Engineering Contradiction:
Improvestructural integrityVSAvoidcracking risk
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The electrostatic chuck is divided into multiple separate ceramic bodies (first electrostatic chuck body, second electrostatic chuck body, third electrostatic chuck body) instead of using a single monolithic structure. Each body contains specific functional elements (electrodes, heating elements) and can be manufactured and tested independently, reducing the risk of cracking during manufacture and use while maintaining structural integrity through controlled bonding interfaces

Inventive Principle:
Principle #1Segmentation

2Adaptability or versatility

If multiple functional elements are embedded in a single electrostatic chuck body, then the functionality is improved, but the complexity of manufacture increases

Engineering Contradiction:
ImprovefunctionalityVSAvoidmanufacture complexity
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

Different functional elements (electrodes, heating elements, cooling channels) are distributed across multiple separate ceramic bodies rather than embedding all functions in a single complex body. This segmentation allows each body to be manufactured with simpler geometry and fewer embedded features, reducing manufacturing complexity while achieving comprehensive functionality through assembly

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Each ceramic body is designed to perform multiple functions within its structure. For example, the first electrostatic chuck body contains both first electrodes for electrostatic chucking and first heating elements for thermal control. This multi-functionality at the component level reduces the need for additional separate components, simplifying the overall assembly

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Device complexity

If a monolithic structure is used, then the device complexity is reduced, but the ability to adjust and customize thermal response is limited

Engineering Contradiction:
Improvestructural simplicityVSAvoidthermal response customization
Core Design Contradiction:
Device complexityVSAdaptability or versatility

Solution Approach 1:

The electrostatic chuck is segmented into multiple independent ceramic bodies, each capable of being customized with specific heating elements, cooling channels, and thermal insulation features. This segmentation enables different thermal responses in different regions or zones of the chuck, allowing customization of thermal characteristics while maintaining relatively simple individual component structures

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different ceramic bodies or regions within bodies are designed with different thermal properties through selective placement of heating elements, cooling channels, and insulation materials. This allows local optimization of thermal response characteristics in specific areas of the electrostatic chuck, enabling customized thermal management for different processing requirements

Inventive Principle:
Principle #3Local quality

4Reliability

If the entire electrostatic chuck is replaced upon functional component failure, then the reliability is maintained, but the loss of time and material increases

Engineering Contradiction:
Improvefunctional reliabilityVSAvoidreplacement time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The electrostatic chuck is designed as an assembly of multiple separate ceramic bodies that can be independently removed and replaced. If a functional component fails in one body, only that specific body needs to be replaced rather than the entire chuck assembly, significantly reducing replacement time and material waste while maintaining the reliability of the overall system

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The modular design allows damaged or worn ceramic bodies to be selectively discarded and replaced, while functional bodies are retained and reused. This selective replacement strategy reduces material waste and extends the overall lifecycle of the electrostatic chuck system, improving both economic efficiency and environmental sustainability

Inventive Principle:
Principle #34Discarding and recovering

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Facilitates quick assembly and testing of substrate supports, reduces risk of cracking, and allows for tailored thermal performance by adjusting individual plates, enhancing reliability and flexibility.

Implementation Method 1

an interface layer at least partially bonding the first puck plate and the second puck plate

Methodology Applied
Scientific EffectBonding: Welding

Implementation Method 2

a first heating electrode in a first heating zone of the body, and a second heating electrode in the first heating zone of the body

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Data Source

PatentUS20250385123A1Modular substrate support assembly
Publication Date: 2025.12.18 APPLIED MATERIALS INC
  • US20250385123A1 patent drawing
  • US20250385123A1 patent drawing
  • US20250385123A1 patent drawing

AI summary

An electrostatic chuck assembly includes a first puck plate including one or more first functional elements, a second puck plate including one or more second functional elements, and an interface layer at least partially bonding the first puck plate and the second puck plate.