Modular Coating System Throughput Adjustment via Longitudinal Block Arrangement
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Solution Overview
Problem
Current coating and developing systems for semiconductor wafers and LCD substrates face challenges in achieving desired throughput due to increased loads on carrying devices and transfer arms when trying to enhance wet-processing units, leading to inefficiencies and the need for multiple system designs to accommodate varying throughput demands.
Innovation Solution
A coating and developing system with processing blocks of the same construction, arranged longitudinally between a carrier block and an interface block, featuring film forming and developing unit blocks, transfer units, and vertically movable transfer arms, allowing for adjustable throughput by varying the number of processing blocks and optimizing substrate carrying routes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of wet-processing units is increased to improve throughput, then productivity increases, but the load on carrying devices increases and carrying efficiency decreases
Solution Approach 1:
The system divides the processing function into multiple independent processing blocks (first processing block, second processing block, etc.), each with its own wet-processing units. This segmentation allows parallel processing of substrates, increasing throughput without requiring a single overloaded carrying device to serve all units. Each processing block can be independently accessed by carrying devices, distributing the carrying load.
Solution Approach 2:
Processing blocks are arranged in a spatial configuration that allows carrying devices to access multiple blocks simultaneously or in sequence without conflict. The system uses multiple carrying devices (first carrying device, second carrying device) that can operate in parallel, utilizing the spatial dimension to distribute carrying tasks and reduce individual device load.
2Productivity
If the number of processing blocks is increased to achieve higher throughput, then productivity increases, but the floor space required increases
Solution Approach 1:
Multiple processing blocks share common infrastructure including carrying devices, transfer arms, and control systems. The first and second processing blocks share the same carrying devices and transfer arms, eliminating the need for duplicate equipment for each block. This merging of resources allows the system to achieve high throughput through parallel processing while minimizing the additional floor space required.
Solution Approach 2:
The carrying devices and transfer arms are designed to serve multiple processing blocks with the same equipment performing identical functions across different blocks. A single carrying device can transport substrates to and from multiple processing blocks, and transfer arms can move substrates between different processing blocks and the carrier block, maximizing equipment utilization and reducing total equipment count.
3Adaptability or versatility
If multiple system designs are created to accommodate varying throughput demands, then adaptability decreases, but the ease of manufacture increases
Solution Approach 1:
The system is designed with modular processing blocks that can be dynamically configured to match throughput requirements. The number of active processing blocks can be adjusted based on demand, and the carrying devices can be dynamically assigned to different blocks. This dynamic configuration allows the same system design to adapt to varying throughput demands without requiring multiple fixed designs.
Solution Approach 2:
The system allows throughput adjustment by changing operational parameters such as the number of active processing blocks, the assignment of carrying devices to specific blocks, and the processing sequence. These parameter changes enable flexible adaptation to different throughput requirements while maintaining the same physical system design, simplifying manufacturing and deployment.
Data Source
AI summary
A coating and developing system includes processing blocks of the same construction each built by stacking up a plurality of unit blocks including a film forming unit block and a developing unit block in layers. The processing blocks are arranged longitudinally between a carrier block and an interface block. The number of processing blocks like the processing blocks arranged between the carrier block and the interface block is adjusted to adjust the throughput of the coating and developing system. Thus, a coating and developing system capable of achieving a desired throughput can be easily designed and manufactured.