Modular On-Die Coherent Interconnect for Scalable Chip Design
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Solution Overview
Problem
As computing systems become more complex, the interconnect architecture to couple and communicate between components also increases in complexity, requiring higher performance while minimizing power consumption, which is challenging to achieve with existing designs, especially in diverse market segments like servers and mobile ecosystems.
Innovation Solution
A modular and scalable on-die interconnect solution is provided using a coherent fabric IP logic that abstracts all coherent fabric functionality into a single intellectual property block, enabling standardized interfaces and reuse across various components, reducing design complexity and effort, and allowing for arbitrary network topologies and configuration settings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If coherent fabric functionality is integrated into each functional component, then communication performance is improved, but device complexity increases
Solution Approach 1:
The patent extracts coherent fabric functionality from individual functional components and consolidates it into a separate, dedicated coherent fabric logic block. This allows each functional component to communicate through standardized interfaces without embedding complex coherent fabric logic within them, thereby maintaining high communication performance while reducing overall device complexity.
Solution Approach 2:
The coherent fabric logic block serves as an intermediary between functional components and the coherent interconnect fabric. It provides standardized interfaces that simplify connections between components and the fabric, eliminating the need for each component to directly implement complex coherent fabric interfaces while preserving communication performance.
2Ease of manufacture
If standardized interfaces are implemented for component coupling, then ease of manufacture is improved, but adaptability to different configurations may be reduced
Solution Approach 1:
The coherent fabric logic block implements universal standardized interfaces that can accommodate multiple types of functional components (processors, memory controllers, I/O devices, etc.). These standardized interfaces maintain design simplicity while preserving adaptability, as the same interface standard can connect diverse components through the coherent fabric.
Solution Approach 2:
The system employs dynamic routing and configuration capabilities within the coherent fabric that allow flexible adaptation to different component topologies and configurations. The standardized interfaces remain static and simple, while the fabric's routing logic dynamically adapts to various system configurations, maintaining both ease of manufacture and adaptability.
3Productivity
If modular coherent fabric logic is used, then productivity is improved through faster development, but validation complexity may increase
Solution Approach 1:
The patent segments coherent fabric functionality into a separate, modular logic block that can be independently developed, tested, and validated. This segmentation allows the coherent fabric to be validated as a standalone module with well-defined interfaces, actually reducing validation complexity compared to validating coherent fabric logic embedded within each functional component. The modular approach enables reuse and reduces overall validation effort.
Data Source
AI summary
In an embodiment, an apparatus comprises: a first component to perform coherent operations; and a coherent fabric logic coupled to the first component via a first component interface. The coherent fabric logic may be configured to perform full coherent fabric functionality for coherent communications between the first component and a second component coupled to the coherent fabric logic. The first component may include a packetization logic to communicate packets with the coherent fabric logic, but not include coherent interconnect interface logic to perform coherent fabric functionality. Other embodiments are described and claimed.