Modular Cold Plate Cooling for Space-Constrained Power Electronics
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Solution Overview
Problem
Conventional heat-dissipating systems in electric and hybrid electric vehicles are inflexible and costly due to their large volume and requirement for redesign when installing space or power supply modifications occur, making them inefficient and not cost-effective.
Innovation Solution
A modular heat-dissipating device that includes a normalized air-cooling or liquid-cooling member selected based on practical requirements, featuring a cold plate and heat-dissipating base with adjustable fixing structures, allowing for efficient heat transfer and simplified integration into various vehicle installations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional air-cooling or liquid-cooling heat-dissipating system is used in a sealed power supply, then heat dissipation function is achieved, but the volume is large and occupying large installing space
Solution Approach 1:
The heat-dissipating system is divided into separate modular components: a cold plate module that attaches to the power supply and a heat-dissipating base module (either air-cooling with fins or liquid-cooling with channels). This segmentation allows the system to be configured in different ways and reduces the overall volume required by optimizing the arrangement of each component.
Solution Approach 2:
The cold plate is designed with a universal structure that can work with both air-cooling bases (with fins and natural/forced convection) and liquid-cooling bases (with internal channels). This multi-functionality allows the same cold plate to serve different heat dissipation needs, reducing the variety of components required and minimizing installing space.
2Adaptability or versatility
If the heat-dissipating system is inclusively designed to accommodate different installing locations and heat generation rates, then adaptability is improved, but the system complexity increases and requires redesign when modifications are needed
Solution Approach 1:
The system employs adjustable fixing structures with multiple positioning holes on both the cold plate and heat-dissipating base. These structures allow the components to be dynamically reconfigured and repositioned according to different installing locations and heat generation rates, providing adaptability without requiring complete system redesign.
Solution Approach 2:
By segmenting the system into modular components with standardized interfaces and adjustable fixing structures, the patent enables easy reconfiguration. Each module can be independently adjusted or replaced, reducing system complexity compared to a monolithic design that would require complete redesign for modifications.
3Temperature
If the heat-dissipating system is designed for sealed power supplies with diversified installing locations and heat transfer directions, then the heat dissipation function is achieved, but the fabrication cost increases due to redesign requirements
Solution Approach 1:
The cold plate is designed as a universal component that can interface with both air-cooling bases (featuring fins for convection) and liquid-cooling bases (featuring internal channels for fluid flow). This universality allows a single cold plate design to serve multiple heat dissipation configurations, reducing fabrication costs by eliminating the need to produce multiple specialized cold plates.
Solution Approach 2:
The system allows parameter changes in heat dissipation approach (air cooling vs. liquid cooling) while maintaining the same basic modular structure. The adjustable fixing structures enable reconfiguration for different heat transfer directions and installing locations without requiring new tooling or manufacturing processes, thereby reducing fabrication costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modular design enhances space utilization and reduces fabrication costs by allowing selection of the heat-dissipating base according to specific vehicle needs, ensuring effective heat dissipation without the need for redesign or re-production.
Implementation Method 1
The heat generated by the electronic device is transmitted to the first slab through the cold plate
Implementation Method 2
The heat generated by the power supply is transmitted to the fins, and radiated to the air according to a natural convection mechanism or removed away by a forced convection mechanism with a fan
Implementation Method 3
a cooling liquid is pumped to a seal groove to remove away the heat generated by the heat source
Data Source
AI summary
A modular heat-dissipating device includes an electronic device, a cold plate and a heat-dissipating base. The electronic device includes a casing, a covering plate and a circuit board. The circuit board is disposed within the casing. Plural electronic components are disposed on the circuit board. The cold plate, the casing and the covering plate are combined together to define a sealed space. The cold plate includes plural first fixing structures. The heat-dissipating base is selected from an air-cooling member or a liquid-cooling member. Each of the air-cooling member and the liquid-cooling member includes a first slab under the cold plate and plural second fixing structures corresponding to the first fixing structures. The air-cooling member and the liquid-cooling member are normalized. The heat generated by the electronic device is transmitted to the first slab through the cold plate, and then dissipated away by the air-cooling member or the liquid-cooling member.