Modular Cold Plate Cooling System for Electronic Circuit Modules
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Solution Overview
Problem
Existing cooling systems for electronic circuit modules face inefficiencies due to variations in component heights, leading to incomplete heat transfer and increased costs with precision machined heatsinks, which are not scalable for mass production.
Innovation Solution
A modular cooling system comprising a frame with compartments and vertically movable cold plates, each with guide features and biasing members to ensure thermal contact with components of varying heights, utilizing a liquid coolant for efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If precision machined heatsinks are used to address varying component heights, then heat transfer effectiveness is improved, but manufacturing cost increases and scalability decreases
Solution Approach 1:
The cooling system is divided into multiple independent cold plates, each corresponding to a specific component height. This segmentation allows each cold plate to be manufactured with standard precision rather than requiring precision machining for the entire assembly, reducing manufacturing cost while maintaining effective heat transfer to components of varying heights
Solution Approach 2:
Each cold plate is designed with specific local characteristics matched to the height of its corresponding component. The compartment walls and cold plates are configured to provide optimal thermal contact for components of particular heights, ensuring effective heat transfer without requiring precision machining across the entire system
2Ease of manufacture
If a single fixed heatsink design is used, then manufacturing simplicity is maintained, but heat transfer effectiveness deteriorates due to component height variations
Solution Approach 1:
The system segments the cooling function into multiple cold plates, each optimized for specific component heights. This allows the manufacturing process to remain simple for each individual cold plate while collectively achieving effective heat transfer across components of varying heights through the modular arrangement
Solution Approach 2:
The cold plates are designed to be vertically movable within their compartments rather than fixed in a single position. This dynamic capability allows each cold plate to adapt to the actual height of its corresponding component, maintaining effective thermal contact without requiring complex precision machining
3Adaptability or versatility
If vertically movable cold plates with guide features are implemented, then adaptability to component height variations is improved, but device complexity increases
Solution Approach 1:
The vertical movement and guiding functionality is segmented into individual compartments and corresponding cold plates rather than requiring a complex centralized mechanism. Each compartment with its cold plate operates independently, reducing overall system complexity while maintaining adaptability to component height variations
Solution Approach 2:
Guide features such as guide slots in the compartment walls and guide pins on the cold plates serve as intermediaries that enable vertical movement and positioning. These simple geometric guide features provide the necessary adaptability without requiring complex actuation mechanisms or control systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively manages heat transfer across components of different heights, enhancing cooling efficiency and scalability while reducing production costs.
Implementation Method 1
utilizing a liquid coolant for efficient heat transfer
Implementation Method 2
each with guide features and biasing members to ensure thermal contact with components of varying heights
Data Source
AI summary
Examples described herein relate to cooling system for an electronic circuit module. The cooling system includes a frame disposable on the electronic circuit module and comprising a plurality of compartments defined by compartment walls. The cooling system further includes a plurality of cold plates disposed in the plurality of compartments of the frame and in thermal contact with the electronic circuit module, wherein the plurality of cold plates includes one or more passages to allow flow of a coolant there-through to conduct heat away from the electronic circuit module. Further, the one or more cold plates of the plurality cold plates include a guide feature to allow vertical movement of the one or more cold plates in respective compartments.