Modular Cold Plate with Segmented Thermal Modules
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Solution Overview
Problem
Existing cold plates for electric power transmission systems, such as HVDC, lack versatility due to fixed shapes and sizes of cooling channels, which restrict their ability to adapt to varying heat sources and heat dissipation needs, leading to inefficient cooling and increased pressure drops.
Innovation Solution
A modular cold plate arrangement comprising a base plate with a fluid inlet and outlet, and a plurality of thermal and support module plates, allowing for customizable placement of heat transfer structures like pin-fins and Triply Periodic Minimal Surfaces (TPMS) to maximize heat transfer while minimizing pressure drops, tailored to specific electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If cooling channels are milled in large aluminium blocks with fixed shapes and sizes, then manufacturing is simplified, but versatility and adaptability to different heat sources are reduced
Solution Approach 1:
The cold plate is divided into modular components: a base plate with fluid channels and multiple detachable thermal module plates that can be independently selected and arranged. Each module can be customized with different heat transfer structures (pin-fins, TPMS, etc.), allowing the system to adapt to various heat source configurations while maintaining straightforward manufacturing of standardized parts.
Solution Approach 2:
The base plate design with standardized fluid channels serves multiple functions: it provides structural support, defines the fluid flow path, and accommodates different arrangements of thermal module plates. This universal base plate can be used across various applications by simply changing the thermal module configuration, thereby achieving versatility without redesigning the entire system.
2Temperature
If more heat transfer structures are added to increase heat dissipation, then cooling performance improves, but pressure drop of cooling fluid increases
Solution Approach 1:
Different thermal module plates feature different heat transfer structures (pin-fins, TPMS, flat plates) with varying thermal and hydraulic characteristics. These modules can be strategically placed in regions with different heat generation densities, allowing high heat transfer areas to be concentrated where needed while maintaining lower pressure drop in other regions, thus optimizing the overall balance between heat dissipation and fluid pressure.
3Productivity
If thermal module plates are placed to match heat-generating regions precisely, then cooling efficiency increases, but assembly complexity increases
Solution Approach 1:
The thermal modules are pre-fabricated as standardized, interchangeable plates with consistent mounting interfaces. This segmentation allows precise positioning of heat transfer structures to match specific heat-generating regions during assembly, while the modular nature with standardized connections simplifies the assembly process compared to custom-fitted non-modular designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modular design enables optimized cooling performance by placing heat transfer structures at specific heat-generating regions, reducing pressure drops and maintaining mechanical integrity, thus providing efficient and adaptable cooling solutions for diverse electronic components.
Implementation Method 1
a plurality of thermal module plates arranged in the enclosure formed in the base plate. At least one of the plurality of thermal module plates comprises a heat transfer structure configured to transfer heat from the power electronic component to the cooling fluid
Implementation Method 2
The modular cold plate arrangement comprises a base plate comprising an enclosure configured to hold a cooling fluid... a fluid inlet configured to allow a cooling fluid to enter the enclosure... a fluid outlet configured to allow the cooling fluid to leave the enclosure
Data Source
Figure 1a~1b
Figure 2~3a
Figure 3b~3c
AI summary
An arrangement (100) and a method (1000) for assembling the arrangement are provided. The modular cold plate arrangement is configured to cool an electronic component. The arrangement comprises a base plate (110) comprising an enclosure (120) configured to hold a cooling fluid. The arrangement further comprises a fluid inlet (130) configured to allow a cooling fluid to enter the enclosure. The arrangement further comprises a fluid outlet (140) configured to allow the cooling fluid to leave the enclosure. The arrangement further comprises a plurality of thermal module plates (150) arranged in the enclosure formed in the base plate. At least one of the plurality of the thermal module plates comprises a heat transfer structure (160) configured to transfer heat from the electronic component to the cooling fluid.