Modular Communication Device Segmentation for Repair

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Solution Overview

Problem

Intercom headsets used in quick service restaurant environments suffer from mechanical breakage due to harsh handling conditions, leading to costly and time-consuming repair processes, with most repairs requiring the headset to be sent to a facility and resulting in multiple repairs throughout its lifespan.

Innovation Solution

A modular communication system comprising detachable speaker carriers and electronics modules with wireless transceivers, allowing for easy replacement of vulnerable components like headbands and microphones, reducing repair costs and time by enabling on-site maintenance and configuration changes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the headset is designed as a single integrated unit, then the structural integrity is maintained, but the repair time and cost increase significantly

Engineering Contradiction:
Improvestructural integrityVSAvoidrepair time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The headset is divided into separate functional modules including a speaker carrier, electronics module, battery pack, and headband assembly. These modules can be independently replaced, allowing rapid repair of damaged components without disassembling the entire device. The speaker carrier assembly can be quickly detached and replaced at the restaurant site, reducing repair time from weeks to minutes.

Inventive Principle:
Principle #1Segmentation

2Ease of manufacture

If the headset is designed as a single integrated unit, then the manufacturing process is simpler, but the ease of repair deteriorates

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidrepairability
Core Design Contradiction:
Ease of manufactureVSEase of repair

Solution Approach 1:

The headset employs modular segments that can be independently manufactured and assembled. The speaker carrier, electronics module, and headband can be produced separately and then connected through standardized interfaces, simplifying both manufacturing and repair processes.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The standardized mechanical and electrical interfaces between modules allow a single electronics module to be compatible with multiple speaker carrier types, and vice versa. This universality enables flexible repair options where any module can be replaced with any compatible module from the same product family.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Duration of action of stationary object

If the headset uses traditional mechanical connections, then the device durability is adequate, but the repair cost and downtime increase

Engineering Contradiction:
Improvedevice lifespanVSAvoiddowntime
Core Design Contradiction:
Duration of action of stationary objectVSLoss of time

Solution Approach 1:

The headset is designed with pre-configured modular assemblies that can be replaced as complete units. The speaker carrier assembly is pre-assembled with the speaker, microphone, and related components, allowing the entire assembly to be swapped out in one action rather than requiring component-by-component repair.

Inventive Principle:
Principle #10Preliminary action

4Productivity

If the headset is designed for long-term use without maintenance, then the operational continuity is improved, but the mechanical breakage risk increases

Engineering Contradiction:
Improveoperational continuityVSAvoidmechanical durability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The modular design allows the headset to be maintained by replacing worn or damaged modules rather than attempting to repair them. The headband and speaker carrier can be independently replaced when they reach the end of their service life, extending the overall system lifespan without requiring complex maintenance procedures.

Inventive Principle:
Principle #34Discarding and recovering

Data Source

PatentEP2859661B1Modular communication device and system
Publication Date: 2020.04.08 PAR TECH LLC
  • EP2859661B1 patent drawingFigure 1~2
  • EP2859661B1 patent drawingFigure 3~4
  • EP2859661B1 patent drawingFigure 5

AI summary

The technology disclosed herein relates to a modular communication device and a system. The modular communication device has a speaker carrier and an electronics module. The speaker carrier has a speaker and an attachment portion, and the electronics module has a wireless transceiver. The speaker carrier and the electronics module are detachably coupled so that the electronics module provides audio signals to the speaker when the speaker carrier and electronics module are coupled. The speaker carrier can be removed from and attached to the electronic module. In one embodiment, the system generally has two or more modular communication devices and a base station that allows communication between the modular communication devices.