Modular Compute Chiplet Architecture for Thermal and Power Constraints
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Solution Overview
Problem
Existing high-performance computing systems face challenges in thermo-mechanical reliability due to stress gradients and thermal issues, and existing solutions like throttling processor cores to manage power and thermal issues compromise performance, while data processing demands increase, requiring efficient and flexible computing architectures that maintain performance and reduce power consumption.
Innovation Solution
A modular computing system with reconfigurable blocks and a network that enables flexible and modular computing architectures, which are interconnected and interconnected, allowing for easy assembly, reconfiguration, and replacement of computing units, and efficient cooling using simple heat sink technology.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If processor clock frequency is throttled to manage power consumption and thermal issues, then power consumption and thermal issues are managed, but processing performance deteriorates
Solution Approach 1:
The system segments the monolithic CPU into multiple independent chiplets (compute chiplets, I/O chiplets, storage chiplets) that can operate independently. This allows selective activation and frequency control of individual chiplets based on workload requirements, enabling fine-grained power management without throttling the entire processor, thus maintaining high performance when needed while reducing power consumption for specific segments during low-demand operations.
Solution Approach 2:
The system implements dynamic configuration where chiplets can be selectively enabled, disabled, or reconfigured based on real-time computational demands. The interconnect fabric dynamically routes data between active chiplets, allowing the system to adapt its operational state and power consumption levels without compromising overall processing capability when high performance is required.
2Productivity
If multiple chiplets are integrated in an MCM to scale beyond Moore's Law, then computing capacity increases, but thermo-mechanical reliability deteriorates due to stress gradients and thermal loads
Solution Approach 1:
The system divides the computing platform into separate, independently packaged chiplets connected via an interconnect fabric, rather than integrating all components into a single monolithic MCM. This segmentation allows each chiplet to be optimized and packaged separately, reducing thermal density in any single location and improving heat dissipation, while maintaining high computing capacity through parallel operation of multiple chiplets.
Solution Approach 2:
The system introduces an interconnect fabric as an intermediary layer between chiplets, which manages data transmission and synchronization. This fabric is designed with thermal management capabilities and can route data through paths that minimize thermal interference between chiplets, thereby maintaining reliability while enabling high computing capacity through multiple interconnected components.
3Stability of the object's composition
If conventional stiffener rings are used to constrain substrate thermal deformation, then substrate warpage is reduced, but chip-side thermal deformation constraint is insufficient
Solution Approach 1:
The system introduces an underfill material as an intermediary substance between the chiplet and substrate. This underfill material has matched thermal expansion properties that constrain thermal deformation at the chip-substrate interface, providing better thermal matching and reducing stress gradients compared to conventional stiffener rings that only constrain the substrate without bonding to the chip sides.
4Adaptability or versatility
If modular architecture is implemented for reconfigurability and flexibility, then adaptability improves, but device complexity increases
Solution Approach 1:
The system segments the computing platform into standardized, pre-fabricated chiplet modules with defined interfaces and functions. These modular chiplets can be independently designed, tested, and manufactured, then assembled into different configurations based on computational needs. This segmentation enables reconfigurability while managing complexity through standardization and independent module development.
Solution Approach 2:
The system employs universal interconnect interfaces and communication protocols that allow the same chiplet types to be used in multiple different configurations and applications. This universality reduces the number of unique components needed and simplifies the design process, enabling high adaptability without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides high-performance computing with flexible architectures that can be easily reconfigured and cooled efficiently, maintaining performance and reducing power consumption, while allowing for easy maintenance and scalability.
Implementation Method 1
efficient cooling using simple heat sink technology
Data Source
AI summary
A system and method for enabling reconfigurable and flexible modular compute (M). The environment (100) may include modular system (M) including a first modular system (M1), a second modular system (M2), peripheral equipments (105), a network (107), and optionally, remote user device (109). The method includes placing at least one first reconfigurable block of one or more reconfigurable blocks on a first modular platform, placing at least one second reconfigurable block of one or more reconfigurable blocks on a second modular platform, placing a plurality of components surrounding the first reconfigurable block and the second reconfigurable block on respective the first modular platform and the second modular platform, configuring one or more interconnections between the plurality of components to form a modular network.