Modular Computer System With Transient Cooling Modules
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Solution Overview
Problem
Current modular computer systems lack flexibility and upgradability, as heat dissipation components are often rigidly integrated within the chassis, making it difficult to replace or upgrade them, and they do not allow for easy expansion of performance components like battery capacity, graphical processing power, or memory without compromising on user preferences.
Innovation Solution
A modular computer system design that includes a module kit with interchangeable modules, such as a cooling module and a graphics processing module, which can be transiently installed within a slot on the chassis, allowing for thermal and electrical coupling to dissipate heat and expand operational performance, including battery capacity, graphical processing power, and memory, while enabling users to customize according to their preferences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If heat dissipation components are rigidly integrated within the chassis, then structural stability is improved, but ease of repair and upgradability deteriorates
Solution Approach 1:
The computer system is divided into modular components where the chassis and heat dissipation components are separate replaceable units. The chassis includes a first housing with a module slot, and heat dissipation components can be independently replaced without affecting the entire system structure, resolving the contradiction between structural stability and ease of repair.
2Manufacturing precision
If performance components are fixed in the chassis, then manufacturing precision is improved, but adaptability deteriorates
Solution Approach 1:
The chassis is designed with a universal module slot that can accommodate different types of performance components (graphics processing units, memory modules, storage devices) through standardized interfaces. This allows the same chassis structure to support multiple configurations and upgrades, maintaining manufacturing precision while improving adaptability.
3Device complexity
If heat dissipation components are integrated within the chassis, then device complexity is reduced, but ease of operation deteriorates
Solution Approach 1:
Heat dissipation components are extracted from the fixed chassis structure and made into separate replaceable modules. Users can easily access, remove, and replace these components through the module slot without disassembling the entire device, significantly improving ease of operation while maintaining relatively simple device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for efficient heat dissipation and performance expansion, enabling users to customize their system based on needs, maintaining operational efficiency and flexibility, and allowing for easy replacement of degraded components, thus extending the system's lifespan.
Implementation Method 1
The first set of fans is configured to thermally couple the first set of heat pipes to dissipate heat transferred from the controller
Implementation Method 2
a first set of heat pipes thermally coupled to the controller and extending proximal the module slot of the chassis
Implementation Method 3
The second set of fans is configured to thermally couple the first set of heat pipes and the second set of heat pipes to dissipate heat transferred from the controller and the graphics processing unit
Implementation Method 4
The second set of heat pipes extends within the second frame and is thermally coupled to the graphics processing unit
Data Source
AI summary
One variation of a modular computer system includes: a chassis; a graphics processing module; and a cooling module. The chassis: defines a slot; includes a controller; and a first heat pipe coupled to the controller. The cooling module includes: a first frame configured to transiently couple the chassis to locate the cooling module within the slot; and a first fan configured to couple the first heat pipe to dissipate heat transferred from the controller. The graphics processing module includes: a second frame configured to transiently couple the chassis to locate the graphics processing module within the slot; a graphics processing unit configured to electronically couple the controller; a second heat pipe coupled to the graphics processing unit; and a second fan configured to couple the first heat pipe and the second heat pipe to dissipate heat transferred from the graphics processing unit and the controller.