Modular Computing Device Assembly with Releasable Retention and Interlock
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Solution Overview
Problem
Mobile computing devices face challenges in reworkability, impact resistance, and component accessibility due to strong bonds and complex geometries, making them difficult to repair and maintain after accidental drops.
Innovation Solution
The design incorporates a releasable display module retention assembly with hinge and latch retainers, a non-destructively releasable adhesive for the battery module, and a mechanical interlock using cross-shaped chambers for improved reworkability and durability, allowing for easy disassembly and assembly while maintaining structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If components are adhered together with strong bonds to prevent displacement from fall, then reliability is improved, but ease of repair deteriorates
Solution Approach 1:
The device is divided into modular components (display assembly, battery module, housing) that can be independently serviced. The display assembly is further segmented into sub-components that can be replaced separately, enabling targeted repairs without dismantling the entire device.
Solution Approach 2:
The bonding system transitions from static permanent bonds to dynamic reversible bonds. Stretch-release adhesives allow the bond strength to change based on applied stress, enabling easy separation when force is applied during repair while maintaining strong bonding during normal use.
2Productivity
If components form complicated geometries to achieve light weight and small size, then productivity is improved, but ease of repair deteriorates
Solution Approach 1:
Complex geometries are segmented into modular components with standardized connection interfaces. This allows the overall compact design to be maintained while enabling easy access to individual components through standardized attachment and detachment mechanisms.
Solution Approach 2:
Standardized attachment mechanisms serve multiple functions: they provide structural support, enable disassembly for repair, and allow rapid reassembly. The same interface design is used across different components, simplifying the repair process despite complex internal geometries.
3Reliability
If strong bonds are used to prevent component displacement during impact, then reliability is improved, but device complexity increases
Solution Approach 1:
The bonding system uses adhesives with variable properties that change based on conditions. The stretch-release adhesive has different mechanical properties under normal stress versus impact stress, providing strong bonding during impact while allowing easy release during repair, thereby reducing the need for complex multi-layer bonding systems.
Data Source
AI summary
A computing device is assembled to withstand drops, to be re-workable, and to reduce unaesthetic variances between the components. A computing device has a display module that is removably hinged on the bottom, held in place by snap fits on the top before being screwed in place, and held in place by replaceable snap fits on the sides. A battery module and a battery connector can be secured in place with stretch removable tape. A peripheral port component may be biased towards an interior of the housing opening when installed. A laser direct structuring antenna module located in a recess of a plastic molding can be grounded to a metal alloy housing. A plastic molding can be mechanically interlocked to a housing.