Modular Connector Layout for High-Speed Signals and Thermal Rigidity

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Solution Overview

Problem

The increasing number of terminals in I/O connectors leads to a significant increase in size, deteriorating thermal deformation resistance, risking CTE mismatch and link breakage, while the use of shielding sheets between terminals complicates manufacturing and increases costs.

Innovation Solution

A connector design with longitudinal separation ribs dividing the housing into module cavities, combined with a rear cover and stiffened plates, enhances thermal deformation resistance and suppresses warping, and separates low-speed and high-speed terminal areas to reduce crosstalk without needing shielding sheets.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If the quantity of terminals in the I/O connector is increased to improve transmission rate, then the data transmission capability is improved, but the size of the connector increases and thermal deformation resistance deteriorates

Engineering Contradiction:
Improvedata transmission rateVSAvoidthermal deformation resistance
Core Design Contradiction:
SpeedVSStrength

Solution Approach 1:

The connector is divided into multiple modules (first module, second module, etc.) that are arranged in series. Each module contains a specific number of terminals (e.g., 40 terminals per module), allowing the total terminal count to be distributed across multiple smaller units. This segmentation maintains thermal deformation resistance by limiting the size of each individual module while achieving high transmission rates through the combined capacity of multiple modules.

Inventive Principle:
Principle #1Segmentation

2Reliability

If shielding sheets are disposed between all adjacent terminals to avoid crosstalk, then the anti-crosstalk capability is improved, but the manufacturing complexity and costs increase

Engineering Contradiction:
Improveanti-crosstalk capabilityVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

Shielding sheets are selectively disposed only between certain adjacent terminals where crosstalk is most critical, rather than between all adjacent terminals. The patent specifies that shielding sheets are placed between terminals in different differential pairs that are adjacent to each other, while omitting shielding sheets in areas where crosstalk is less significant. This local approach maintains adequate anti-crosstalk capability while significantly reducing manufacturing complexity and costs.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS20250210918A1Connector, terminal arrangement method, and electronic device
Publication Date: 2025.06.26 HUAWEI TECH CO LTD
  • US20250210918A1 patent drawing
  • US20250210918A1 patent drawing
  • US20250210918A1 patent drawing

AI summary

A connector includes: a housing including at least one longitudinal separation rib, where the at least one longitudinal separation rib separates the housing into a plurality of module cavities; and a plurality of modules, where each module in the plurality of modules is disposed in one module cavity in the plurality of module cavities that corresponds to the module. The plurality of modules are combined and then divided into at least one low-speed area and at least one high-speed area, and the at least one low-speed area and the at least one high-speed area are arranged in a specified sequence. Any one of the plurality of modules includes a plurality of terminals. An increasing demand for high-speed signal transmission can be met, and a thermal deformation resistance capability is strong. A good anti-crosstalk capability is provided, and a shielding sheet does not need to be disposed between all signal terminals.