Modular Control Unit Layout for Compact PCB Cooling and Expansion
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Solution Overview
Problem
Industrial automation systems face challenges in achieving compact designs with effective cooling and flexible expandability due to limited space and high thermal loads, while maintaining high component density and adaptability to changing performance and interface requirements.
Innovation Solution
A modular control system with a main module featuring a heat sink attached to the base, which carries circuit boards, optimizing space usage and enabling compact, high-density designs with enhanced cooling capabilities through internal and external cooling fins, and allowing for flexible expansion via a backplane bus circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a compact design with limited space is used for the controller housing, then the controller size is reduced and installation space is optimized, but the available space for circuit boards and connections is severely limited
Solution Approach 1:
The patent transitions from traditional planar PCB mounting to three-dimensional vertical stacking of circuit boards. Multiple PCBs are arranged in layers along the vertical dimension, with the first PCB mounted on the base and subsequent PCBs stacked above it, connected via vertical connection elements. This dimensional change maximizes the use of limited housing space while maintaining adequate area for circuit board components and connections.
2Ease of manufacture
If traditional separate mounting of heat sink and circuit boards is used, then assembly is straightforward, but space utilization in the housing is not optimized and component density is reduced
Solution Approach 1:
The patent merges the heat sink with the base structure, forming an integrated thermal management system. The heat sink is directly coupled to the base, and circuit boards are mounted on the heat sink surface, eliminating the need for separate mounting brackets or additional fastening mechanisms. This consolidation increases component density while maintaining assembly simplicity through the integrated design.
3Ease of manufacture
If fixed controller configuration is used, then manufacturing is simplified, but flexibility to adapt to changing performance and interface requirements is reduced
Solution Approach 1:
The patent segments the controller into modular components: a base with heat sink, multiple stackable circuit boards, and connection elements. This segmentation allows for flexible configuration where different numbers and types of PCBs can be stacked according to specific application requirements, while the base module remains standardized for simplified manufacturing.
4Quantity of substance
If high component density is achieved through compact stacking, then space utilization is optimized, but thermal loads increase and cooling becomes more challenging
Solution Approach 1:
The patent introduces the heat sink as an intermediary thermal management component between the circuit boards and the surrounding environment. The heat sink provides thermal contact with the PCBs through direct mounting on its surface, facilitating heat dissipation. Cooling channels or fins on the heat sink structure enable efficient thermal management of the high-density component arrangement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides efficient cooling and flexible expansion options, maintaining high component density and adaptability to changing requirements, while simplifying assembly and reducing the need for additional components, thus addressing the limitations of existing systems.
Implementation Method 1
a heat sink (50) for cooling components is assigned to the main circuit board (23)
Implementation Method 2
The heat sink has internal cooling fins through which cooling channels are formed. Thus, the heat sink has large outer surfaces that can be used as cooling surfaces and are in thermal contact with the components to be cooled
Data Source
Figure 1
Figure 2a
Figure 2b
AI summary
The invention relates to a control unit for an industrial automation system, having a main module (1) with a housing that can, together with a base (10), be placed on a top-hat rail, and with at least two circuit boards (20) arranged in the housing, of which one is a rear panel bus circuit board (21 ) and one is a main circuit board (23), wherein a cooling body (50) is assigned to the main circuit board (23) for cooling the components and wherein the rear panel bus circuit board (21) provides a rear panel bus for at least one expansion module (2) that can be laterally daisy-changed. The control unit is characterised in that the cooling body (50) is arranged in the housing, is fastened to the base (10) and supports at least one of the circuit boards (20). The invention further relates to a control system with a control unit of this kind with a main module (1) that is connected via a rear panel bus circuit board (21) to at least one daisy-chained expansion module (2).