Modular Controller Heat Sink Layout for Dense PCB Cooling
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Solution Overview
Problem
Industrial automation systems face challenges in achieving compact construction with high component density and efficient cooling, while also requiring flexibility in printed circuit board surface area and connections, due to limited space and changing performance and interface requirements.
Innovation Solution
A controller with a main module featuring a heat sink attached to the housing base, which supports printed circuit boards and provides enhanced cooling through a parallelepipedal configuration with perpendicular outer surfaces, inner and outer cooling fins, and mounting feet, allowing for efficient heat dissipation and additional equipment space without increasing installation height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a compact construction with high component density is implemented, then the space utilization in the housing is improved, but the cooling of electronic components becomes more difficult due to limited space
Solution Approach 1:
The housing base is merged with the heat sink into a single integrated component. The heat sink is attached to the housing base, combining the structural support function with the thermal management function, thereby achieving both compact construction and effective cooling within limited space
Solution Approach 2:
The housing base serves multiple functions: it provides mechanical support for the printed circuit boards and simultaneously acts as a heat sink for cooling electronic components. This multi-functionality resolves the contradiction by eliminating the need for separate cooling components that would increase space requirements
2Adaptability or versatility
If the controller is made expandable to meet changing performance and interface requirements, then the adaptability is improved, but the device complexity increases
Solution Approach 1:
The controller is segmented into a main module and optional expansion modules that can be selectively added or removed. The main module contains core functionality, while expansion modules provide additional interfaces and capabilities, allowing the system to be expanded without redesigning the entire controller
Solution Approach 2:
The housing base and heat sink are pre-assembled as an integrated unit before final controller assembly. This preliminary integration simplifies the overall assembly process and reduces the complexity of coordinating multiple components during final assembly
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a compact, high-density main module with improved cooling performance, flexibility in printed circuit board arrangement, and the ability to operate autonomously or expand via field bus connections, addressing the need for efficient cooling and adaptability in industrial automation systems.
Implementation Method 1
heat sink arranged in a housing (60) and attached to the housing base (10) to support at least one printed circuit board (20) arranged within the housing (60)
Implementation Method 2
heat sink has a substantially parallelepipedal configuration with two mutually perpendicular outer surfaces... at least one outer surface of the heat sink preferably includes a cooling surface
Data Source
AI summary
A controller for an industrial automation system includes a main module having a housing, which can be fitted onto a DIN rail via a base, at least two printed circuit boards arranged in the housing, and a heat sink also arranged in the housing and connected with the base. One of the circuit boards is a backplane bus printed circuit board, which provides a backplane bus, and the other is a main printed circuit board. The heat sink is attached to at least one of the printed circuit board to cool its components.