Modular Cooling Block Connector for Stackable Electronics Cooling
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Solution Overview
Problem
Existing cooling blocks for heat-generating electronic components are limited by space efficiency and material usage, hindering the stacking and thermal contact with multiple components.
Innovation Solution
A modular cooling block design with connectors that allow for reduced thickness and increased thermal surface area, enabling stacking and connection to fluid sources without interfering with thermal transfer surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the cooling block is designed with integrated piping connections, then the thermal transfer surface area is maximized, but the block thickness increases and stacking efficiency decreases
Solution Approach 1:
The cooling block is divided into a base portion containing thermal transfer surfaces and a separate connector portion containing piping connections. This segmentation allows the thermal transfer surfaces to maintain maximum area while the connector handles the thickness increase, enabling efficient stacking of multiple cooling blocks without compromising thermal performance.
2Ease of manufacture
If the cooling block uses traditional integrated design, then manufacturing is simpler, but material usage increases and space efficiency decreases
Solution Approach 1:
By separating the cooling block into base and connector portions, material can be optimized in each section. The base uses minimal material for thermal transfer surfaces while the connector uses material only where needed for piping connections, reducing overall material usage compared to traditional integrated designs.
Solution Approach 2:
The connector portion serves multiple functions: it provides piping connections, extends the block thickness for stacking, and maintains structural integrity. This multi-functionality reduces the need for additional components and minimizes material usage while achieving space efficiency.
3Ease of operation
If the connector thickness is greater than the cooling block body, then piping access is improved and stacking is enabled, but the overall block height increases
Solution Approach 1:
The connector extends in the vertical dimension (thickness direction) rather than expanding the horizontal footprint. This dimensional change allows piping access to be improved and stacking to be enabled while maintaining a compact overall block height suitable for vertical stacking configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates efficient cooling of multiple components with reduced material usage, allowing for cost-effective and space-efficient cooling solutions.
Implementation Method 1
water (or other fluid) is made to flow through a conduit in the cooling block to absorb heat from the heat-generating electronic component through the thermal transfer surface
Data Source
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AI summary
A connector for a cooling block having a connector body defining at least one connector passage. The connector is connectable to a top side of the cooling block body such that the at least one connector passage is in fluid communication with one or both of a conduit inlet and a conduit outlet of the cooling block. A cooling block comprising a cooling block body defining a fluid conduit therein for circulating a cooling fluid therethrough, the fluid conduit having a conduit inlet and a conduit outlet for receiving and discharging the cooling fluid respectively, and the connector connected to the top side of the cooling block body such that the at least one connector passage is in fluid communication with one or both of the conduit inlet and the conduit outlet of the cooling block.