Modular Heterogeneous Data Center Cooling Chassis

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Solution Overview

Problem

Conventional data center cooling solutions fail to effectively manage temperature variations across different IT clusters and do not accommodate diverse fluid systems, leading to inefficient cooling and potential server reliability issues due to increased temperatures.

Innovation Solution

A heterogeneous cooling system with a modular design that includes a main chassis fixed on electronic racks and an extension chassis that moves to connect with external cooling sources, providing fluid connections and containment regions to efficiently manage heat across multiple IT systems.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If conventional cooling solutions are used, then the system structure is simple, but the cooling efficiency and adaptability to different IT clusters deteriorate

Engineering Contradiction:
Improveadaptability to different IT clustersVSAvoidcooling system structure
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The cooling system is divided into separate modules: a first cooling system for first IT clusters and a second cooling system for second IT clusters. Each cooling system can be independently configured and connected to different IT clusters through connection ports, enabling flexible adaptation without requiring a completely different system architecture.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The cooling apparatus includes universal connection ports that can interface with different types of IT clusters through flexible connectors. The same cooling apparatus can serve multiple IT cluster types by simply changing the connection configuration, making the system versatile without proportionally increasing complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If a unified cooling system is used for all IT clusters, then the device complexity is reduced, but the cooling performance for heterogeneous clusters deteriorates

Engineering Contradiction:
Improvecooling performanceVSAvoidcooling system architecture
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Different cooling systems are provided for different IT cluster types based on their specific cooling requirements. The first cooling system is optimized for first IT clusters while the second cooling system is optimized for second IT clusters, ensuring each cluster receives tailored cooling performance rather than a one-size-fits-all approach.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The system allows dynamic configuration where connection ports can be connected to different IT clusters through flexible connectors. This dynamic reconfigurability enables the cooling system to adapt to changing cluster requirements while maintaining reliable cooling performance through proper system-matched design.

Inventive Principle:
Principle #15Dynamics

3Adaptability or versatility

If conventional cooling solutions are used, then the installation is simple, but the ability to accommodate different fluid systems deteriorates

Engineering Contradiction:
Improveaccommodation of different fluid systemsVSAvoidinstallation complexity
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

Flexible connectors serve as intermediary components between the cooling apparatus connection ports and the IT clusters. These flexible connectors accommodate different fluid system configurations and connection requirements, enabling the cooling system to work with various fluid systems without requiring complex custom integration for each type.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS12082380B2Prefabricated module for heterogeneous data centers
Publication Date: 2024.09.03 BAIDU USA LLC
  • US12082380B2 patent drawing
  • US12082380B2 patent drawing
  • US12082380B2 patent drawing

AI summary

Systems and methods to provide a prefabricated module design for heterogeneous data centers are described. An apparatus to provide cooling for an electronic rack of a data center comprises a plurality of lines. A main chassis is coupled to the plurality of lines. The main chassis is configured to be integrated on the electronic rack. An extension chassis is coupled to the main chassis. The extension chassis is configured to move relative to the main chassis. A plurality of connection ports are coupled to the extension chassis to provide connections between the electronic rack and one or more external sources. The plurality of connection ports are configured to move relative to the plurality of lines that are at fixed locations on the electronic rack.