Modular Electronic Device Cooling via Sliding Guide Mechanism
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Solution Overview
Problem
Existing modular systems for electronic devices face challenges in cost-effective assembly and efficient cooling during operation, as they often require complex configurations and inadequate heat dissipation methods.
Innovation Solution
A modular system that incorporates sliding guide devices for cooling elements made of materials with good thermal conductivity, such as copper or aluminum, which are preassembled on the printed circuit board and guided into the housing, ensuring efficient heat dissipation and secure fixation of the circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cooling elements are integrated into the housing structure, then cooling efficiency is improved, but device complexity increases
Solution Approach 1:
The cooling system is segmented into independent cooling elements that can be separately manufactured and then integrated into the housing. Each cooling element is a discrete component with guide devices that allow it to be independently positioned and secured, rather than being a monolithic integrated structure.
Solution Approach 2:
Guide devices act as intermediary elements between the cooling elements and the housing structure. These guide devices facilitate the integration process by providing alignment and securing mechanisms, simplifying the overall assembly while maintaining effective cooling integration.
2Temperature
If multiple cooling elements are arranged on the circuit board, then heat dissipation is improved, but assembly complexity increases
Solution Approach 1:
The cooling system is divided into multiple discrete cooling elements that can be independently arranged on the circuit board according to thermal requirements. Each element is a separate component that can be individually positioned and secured, allowing flexible thermal management without requiring complex integrated cooling structures.
Solution Approach 2:
The guide devices serve multiple functions: they guide the cooling elements during assembly, provide alignment references, and secure the elements in their final positions. This multi-functionality reduces the need for separate assembly fixtures and procedures, simplifying the overall assembly process despite having multiple cooling elements.
3Ease of operation
If guide devices are used for cooling element insertion, then assembly ease is improved, but manufacturing cost increases
Solution Approach 1:
The guide devices are designed to perform multiple functions within a single component structure: guiding insertion, providing alignment, and securing the cooling elements. This multi-functionality reduces the total number of separate components needed, thereby lowering overall manufacturing costs despite the added assembly facilitation.
Solution Approach 2:
The guide devices combine several assembly-aid features into a single integrated structure that is part of the cooling element or housing. By merging guidance, alignment, and securing functions into one component, the manufacturing complexity and cost are minimized while still providing easy assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables simple, cost-effective assembly and effective heat dissipation, preventing overheating by using sliding guide devices to securely attach cooling elements to the housing, allowing for efficient cooling of electronic components.
Implementation Method 1
The cooling element is made of a material with good thermal conductivity, such as copper or aluminum. This allows for efficient heat dissipation from the housing, particularly from components of the electronic device that generate heat during operation.
Implementation Method 2
the at least one cooling element is slidably guided via the first guide device on the second guide device of the housing along the insertion direction
Data Source
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AI summary
The invention relates to a modular system for producing an electronic device (1), comprising a housing (10) which forms an accommodating space (15), and a printed circuit board (12) which can be inserted into the accommodating space (15) of the housing (10) along an insertion direction (E) and is accommodated in the accommodating space (15) in an assembly position. At least one cooling element (16) can be connected to the printed circuit board (12) in such a way that, when the printed circuit board (12) is inserted into the accommodating space (15), the at least one cooling element (16) is displaceably guided along the insertion direction (E) via a first guide device (163) on a second guide device (107) of the housing (10). In this way, a modular system for producing an electronic device that can be configured as a function of an application is provided using a modular system, which enables a simple and thus cost-effective assembly of the electronic device while in addition efficient cooling during operation.