Modular Liquid Cooling Head With Segmented Flow Control

Solution Overview

Problem

Current liquid cooling devices for electronic components, such as central processing units, require improved heat dissipation efficiency and cost-effectiveness to maintain optimal performance and reduce production costs.

Innovation Solution

A modular liquid cooling head design featuring a bottom plate, heat dissipation plate, partition plate, and upper cover plate with cooling chambers, pumps, and electric control devices, along with guiding blades and skived fins, to enhance heat transfer and fluid flow, allowing for adjustable heat dissipation efficiency and reduced production costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a liquid cooling head is used to cool electronic components, then heat dissipation efficiency is improved, but device complexity increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoiddevice complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The cooling head is divided into multiple independent cooling chambers separated by partition plates, with each chamber equipped with its own pump and control device, allowing independent control of cooling liquid flow to different heat sources

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The system employs adjustable pumps with variable rotation speeds controlled by electric control devices, enabling dynamic adjustment of cooling liquid flow rates to match varying heat dissipation requirements of electronic components

Inventive Principle:

Principle #15Dynamics

2Temperature

If cooling chambers are divided into multiple sections with individual pumps, then heat dissipation performance is improved, but manufacturing cost increases

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidmanufacturing cost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The cooling head is divided into multiple independent cooling chambers separated by partition plates, with each chamber equipped with its own pump and control device, allowing independent control of cooling liquid flow to different heat sources

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The system employs adjustable pumps with variable rotation speeds controlled by electric control devices, enabling dynamic adjustment of cooling liquid flow rates to match varying heat dissipation requirements of electronic components

Inventive Principle:

Principle #35Parameter changes

3Ease of manufacture

If modular production is implemented, then production cost is reduced, but device complexity increases

Engineering Contradiction:

Improveproduction costVSAvoiddevice complexity

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The cooling head is divided into multiple independent cooling chambers separated by partition plates, with each chamber equipped with its own pump and control device, allowing independent control of cooling liquid flow to different heat sources

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The cooling head can be configured with different numbers and arrangements of cooling chambers to match various heat dissipation requirements, making it a universal solution for different electronic components while maintaining modular construction

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design significantly improves heat dissipation efficiency and reduces production costs by allowing for customizable heat dissipation based on the heat source's requirements, enhancing the performance and quality of electronic products.

Implementation Method 1

the electric control device rotates the pump to force a cooling liquid to flow through the cooling chambers

Methodology Applied

Scientific EffectForced Convection: Forced Convection

Implementation Method 2

the water cooling head contacts the surface of the metal cover of the electronic component, e.g. the central processing unit, to take away the heat generated by the electronic component during operation

Methodology Applied

Scientific EffectHeat Transfer: Conduction (thermal)

Data Source

PatentUS11930618B2Liquid cooling head and liquid cooling device with the same

Publication Date: 2024.03.12 AURAS TECH

AI summary

A liquid cooling head includes a bottom plate, a heat dissipation plate, a partition plate and an upper cover plate. The bottom plate includes an opening, and the heat dissipation plate, the partition plate and the upper cover plate are fixed to the bottom plate. The partition plate divides the opening into a plurality of cooling chambers, and each cooling chamber is equipped with a cooling liquid inlet, a cooling liquid outlet, a pump and an electric control device. The cooling liquid inlet and the cooling liquid outlet are formed in the upper cover plate, the pump is fluid-connected to the cooling liquid outlet, and the electric control device drives the pump to rotate, so that the cooling liquid flows through the cooling chamber to cool one heat source below the heat dissipation plate. In addition, a liquid cooling device with the liquid cooling head is also disclosed therein.