Modular Immersive Cooling Unit With Heat-Exchange Walls
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Solution Overview
Problem
Existing immersive cooling systems lack modularity and efficiency, particularly in terms of heat exchange and component integration.
Innovation Solution
A modular immersive cooling unit with closed heating and cooling channels, utilizing a convective circulation of dielectric coolant, separated by heat-insulating walls, and incorporating heat-conducting materials to enhance heat exchange and minimize heat leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If walls are used to separate heat exchangers and electronic components, then thermal isolation is achieved, but self-induced double and symmetrical circulation is caused reducing efficiency
Solution Approach 1:
The system is divided into multiple independent cooling channels (first cooling channel, second cooling channel) that can operate autonomously. Each channel has its own flow path and heat exchange zones, allowing asymmetric flow patterns that improve cooling efficiency while maintaining thermal isolation through the partition walls.
Solution Approach 2:
The patent introduces asymmetric flow patterns by creating unequal cross-sectional areas in different zones of the cooling channels. The first and second cooling channels have different flow characteristics, and the heating channels have varying cross-sections along their length, which prevents symmetrical circulation and enhances convective heat transfer.
2Productivity
If closed cooling channels with heat conducting materials are used, then heat exchange efficiency is improved, but system complexity increases
Solution Approach 1:
The patent combines multiple functions into the channel walls: they serve as structural elements defining the cooling channels, as thermal isolation barriers between adjacent channels, and as heat exchange surfaces through incorporated heat conducting materials. This integration reduces the need for separate heat exchanger components and simplifies the overall system architecture.
Solution Approach 2:
The cooling channel walls perform multiple functions simultaneously: they provide structural containment for the coolant, isolate thermal fields between adjacent channels, and facilitate heat transfer through integrated heat conducting materials. This multi-functionality reduces system complexity while maintaining high heat exchange efficiency.
3Adaptability or versatility
If modular cooling units are implemented, then system flexibility and adaptability are improved, but connection complexity between modules increases
Solution Approach 1:
The modular cooling units are designed to be nested or stacked configurations where multiple units can be combined vertically or horizontally. The standardized interfaces allow units to be interconnected in various arrangements, providing system flexibility while using simple repetitive connection structures rather than complex custom interfaces.
Solution Approach 2:
The connection structures between modular units serve multiple functions: they provide mechanical coupling for structural integrity, establish fluid flow paths between adjacent modules, and maintain thermal isolation where needed. This multi-functionality reduces the number of separate components required for module interconnection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced cooling efficiency and modularity, allowing for flexible integration of electronic components and efficient heat management, with the ability to reuse extracted heat for other applications.
Implementation Method 1
The channels each allow a coolant flow having at least a vertical component
Implementation Method 2
at least a portion of the cooling channel wall is formed by a heat conducting material, said portion allowing an exchange of heat between a part of the coolant in contact with an interior side of said cooling channel wall portion and a surrounding in contact with an exterior side of said cooling channel wall portion
Implementation Method 3
The electronic components on the printed circuit boards can be any heat dissipating electronic such as high powered MOSFETs or processing unit or storage units such as CPU, GPU, NVMe, FPGA, or amplifiers, Rontgen power units, ASIC, MPU, MCU's, Photonics and/or Optics, or specially adapted capacitors
Data Source
AI summary
The present invention is related to an immersive cooling unit (1), comprising at least one closed heating channel (2), defined by at least one circumferential heating channel wall having a start and an end, accommodating one or more printed circuit boards (10), comprising one or more heat dissipating electronic components (5), at least one closed cooling channel (3), defined by at least one circumferential cooling channel wall (6), wherein a start of the cooling channel (3) is connected to an end of the heating channel (2), and wherein an end of the cooling channel (3) is connected to the start of the heating channel (2) such that a closed circuit is formed between the channels (2,3), a liquid coolant, for cooling the electronic components (5), said coolant at least filling the channels (2, 3) and submerging the printed circuit board (10), wherein the channels (2, 3) each allow a coolant flow having at least a vertical component wherein at least a portion (7) of the cooling channel wall (6) is formed by a heat conducting material, said portion (7) allowing an exchange of heat between a part of the coolant in contact with an interior side of said cooling channel wall portion (7) and a surrounding (8) in contact with an exterior side of said cooling channel wall portion (7). The invention is further related to a cooling unit (1) and a holder (15), and a method for using the cooling unit (1).