Modular Cooling Manifolds for Scalable Power Control Modules

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing cooling systems for modular power conversion systems face challenges in efficiently routing cooling fluid to multiple modules with different cooling requirements and flow rates, especially as the number of modules increases and customization becomes necessary.

Innovation Solution

A modular cooling system design featuring a plurality of modules with chassis containing first and second manifold segments, forming common manifolds that align to create fluid channels. The system includes module-specific flow paths, an inlet, a first common manifold, a second common manifold, and an outlet, with blocking and orifice plates used to control fluid flow based on module type and configuration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If different flow paths and dimensions are used for different power electronics, then cooling requirements are met, but system complexity increases

Engineering Contradiction:
Improvecooling requirementsVSAvoidflow path complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The cooling system is divided into modular segments where each power electronics module has its own integrated manifold and flow paths. This segmentation allows each module to be independently configured for its specific cooling requirements while maintaining a standardized interface with the common manifold, thus meeting diverse cooling needs without proportionally increasing overall system complexity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A common manifold design serves multiple functions: it distributes cooling fluid to all modules, collects return fluid, and provides a standardized interface for modular expansion. This universal component reduces the need for custom routing for each module, simplifying the overall system while accommodating different cooling requirements through modular attachments.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Quantity of substance

If the number of modules increases, then system capacity increases, but routing difficulty increases

Engineering Contradiction:
Improvenumber of modulesVSAvoidrouting difficulty
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

Each module is designed as a self-contained segment with integrated manifold connections. This segmentation allows modules to be added or removed without redesigning the entire routing system - new modules simply connect to the common manifold at standardized interfaces, making scaling straightforward despite increasing module count.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The modular architecture allows smaller module units to be nested within the overall system structure, with each module containing its own mini-manifold and flow paths that interface with the larger common manifold. This nested structure enables easy expansion - additional modules can be inserted into the system without disrupting existing routing.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Adaptability or versatility

If customization of module location and number is allowed, then adaptability increases, but cooling system robustness decreases

Engineering Contradiction:
Improvecustomization capabilityVSAvoidsystem robustness
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The common manifold is designed as a universal distribution network with standardized interfaces that can accommodate any module configuration. This universal design maintains system robustness by ensuring consistent fluid distribution regardless of how many modules are present or where they are located, while simultaneously enabling full customization of the power electronics system.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The cooling system is designed with dynamic adaptability - the common manifold can accommodate varying numbers of modules and different configurations through its modular interface design. This dynamic capability allows the system to reconfigure itself as modules are added or removed, maintaining reliable cooling performance across different operational states without requiring a fixed, rigid routing structure.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The modular cooling system effectively manages fluid flow to meet the diverse cooling needs of multiple modules, enhancing scalability and customization while maintaining efficient heat transfer and fluid management.

Implementation Method 1

Components of a power conversion system may require cooling during operation. Certain cooling systems use cooling fluid to cool the components of the system via heat transfer.

Methodology Applied
Scientific EffectHeat transfer: Convection

Data Source

PatentUS12238904B2Cooling system with common modular manifolds
Publication Date: 2025.02.25 BAE SYSTEMS CONTROLS INC
  • US12238904B2 patent drawing
  • US12238904B2 patent drawing
  • US12238904B2 patent drawing

AI summary

A cooling system for a modular power control system (MPCS) is provided. The MPCS comprises modules. Each module has a chassis with a first manifold segment for first common manifold and a second manifold segment for second common manifold. When the modules are mounts to each other, the first manifold segments align to form the first common manifold and the second manifold segments align to form the second common manifold, providing two fluid channels between endcaps. The chassis of at least two modules further have a first opening providing a fluid interface region between the first common manifold and a module specific flow path, and a second opening providing a fluid interface region between the module specific flow path and the second common manifold. The module specific flow path provides at least one fluid branch between the first common manifold and the second common manifold.