Modular Liquid Cooling Module With Flexible Deviation Buffer
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Solution Overview
Problem
Existing liquid cooling solutions for high-density servers and data centers face challenges in assembling multiple cooling elements, reliability due to leakage risks, and inefficiencies in preventing leaks, particularly when multiple processors are packaged closely together.
Innovation Solution
A modular liquid cooling system design featuring flexible deviation buffers and integrated leak detection, which segregates liquid from electronics, allows for easy assembly and maintenance, and contains leaks within the module, preventing liquid from reaching sensitive components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple cooling elements are assembled in a cooling loop, then cooling coverage is improved, but assembly difficulty and error probability increase
Solution Approach 1:
The cooling system is divided into multiple independent cooling elements, each capable of being assembled and tested separately before being integrated into the complete cooling loop. This segmentation allows for simplified individual assembly while achieving comprehensive cooling coverage when all elements are combined.
Solution Approach 2:
A manifold serves as an intermediary component that connects multiple cooling elements to the liquid supply and return lines. The manifold simplifies the assembly process by providing a centralized connection point, eliminating the need for complex individual routing for each cooling element.
2Temperature
If multiple cooling elements are assembled in a cooling loop, then cooling coverage is improved, but assembly cost increases
Solution Approach 1:
By segmenting the cooling system into standardized, modular cooling elements, the patent enables reusable design components that can be manufactured efficiently and assembled in a systematic manner, reducing overall assembly cost despite increased cooling coverage.
Solution Approach 2:
The cooling elements are designed with universal interfaces and standardized configurations that allow them to be used in multiple positions and applications. This multi-functionality reduces the need for custom-designed components, thereby lowering assembly costs.
3Reliability
If leak detection and prevention measures are implemented, then reliability is improved, but system complexity increases
Solution Approach 1:
The manifold acts as an intermediary that incorporates integrated leak detection capabilities. By centralizing the detection function within the manifold rather than requiring separate detection systems for each cooling element, the patent improves reliability while minimizing the increase in system complexity.
Solution Approach 2:
The leak detection function is merged with the manifold structure, combining multiple functions (fluid distribution and leak detection) into a single integrated component. This reduces the overall number of separate systems required and simplifies the overall architecture.
4Object-affected harmful factors
If non-conductive working fluid is used, then leakage harm is reduced, but cooling efficiency decreases
Solution Approach 1:
The system uses an intermediary approach by implementing multiple layers of protection (seals, containment structures, and detection systems) that allow the use of conductive working fluids for optimal cooling efficiency while preventing leakage from reaching sensitive electronics.
Solution Approach 2:
The patent implements beforehand cushioning by providing multiple preventive measures (seals, containment barriers, and monitoring systems) that protect against potential leakage before it can cause harm, enabling the use of highly efficient conductive cooling fluids.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modular design enhances reliability by containing leaks and preventing liquid contact with electronics, simplifies assembly, and reduces mechanical failure rates, while enabling efficient heat transfer and flexible deployment across various IT layouts.
Implementation Method 1
a flexible deviation buffer positioned in the gap between the edges of each liquid cooling element and the edges of its corresponding opening
Implementation Method 2
liquid cooling elements that are attached to electronics components and heat is transferred to a working fluid circulating through these devices
Data Source
AI summary
A cooling module including a module panel comprising a bottom panel with top and bottom surfaces and a set of sidewalls coupled to the entire perimeter of the bottom panel. The bottom panel has openings to receive liquid cooling elements. The liquid cooling elements are inserted into the openings; each has an inlet and an outlet and is positioned so that there is a gap between the edges of the cooling element and the edges of the opening. The inlets and outlets are positioned on the side of the cooling element above the top surface of the bottom panel. A flexible deviation buffer is positioned in each gap and is coupled to the liquid cooling element and to the opening. The deviation buffer allows motion of the cooling element relative to the bottom panel while sealing the gap to prevent liquid from flowing through. The cooling module can improve liquid cooling reliability through quick leakage identification, leakage impact minimization, and segregation of liquid and electronics.