Modular Liquid Cooling Plate Assembly for Multi-Chip Adaptation
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Solution Overview
Problem
Conventional liquid cooling heat dissipation systems require different apparatuses for various chip specifications, leading to increased complexity and production difficulties due to their integral structure, which limits adaptability and universality.
Innovation Solution
A modularized standard heat dissipation apparatus with a separated structure comprising a heat-conducting plate, mounting base, and pressing plate, where the heat-conducting plate is sandwiched between the mounting and pressing plates, allowing for adjustable liquid channels and connectors, enabling flexible adaptation to different chip heat dissipation requirements using standard parts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an integrated liquid cooling heat dissipation apparatus is used, then heat dissipation effectiveness is improved, but adaptability to different chip specifications deteriorates
Solution Approach 1:
The heat dissipation apparatus is divided into separate modules: a mounting base, a heat-conducting plate, and a pressing plate. These modular components can be independently selected and combined based on different chip specifications, allowing the system to maintain effective heat dissipation while adapting to various chip sizes and thermal requirements.
Solution Approach 2:
The mounting base and pressing plate are designed as universal components that can accommodate multiple heat-conducting plates with different specifications. This universal design allows a single apparatus configuration to serve multiple chip types, improving adaptability without compromising heat dissipation effectiveness.
2Reliability
If customized liquid heat dissipation apparatuses are designed for different chips, then heat dissipation performance is improved, but device complexity increases
Solution Approach 1:
By segmenting the apparatus into standardized modules (mounting base, heat-conducting plate, pressing plate), the system reduces complexity through component reuse. Only the heat-conducting plate needs to be customized for different chips, while the mounting base and pressing plate remain standard components, thereby simplifying the overall system design.
Solution Approach 2:
The mounting base and pressing plate are merged as universal support structures that can accommodate multiple heat-conducting plates. This merging of functions into standardized components reduces the total number of unique parts needed, thereby reducing device complexity while maintaining performance.
3Reliability
If customized liquid heat dissipation apparatuses are manufactured for different chips, then heat dissipation effectiveness is improved, but manufacturing difficulty increases
Solution Approach 1:
The apparatus is segmented into modules where only the heat-conducting plate requires customization for different chips. The mounting base and pressing plate can be mass-produced as standard components, significantly reducing manufacturing difficulty and cost compared to customizing entire apparatuses for each chip type.
Solution Approach 2:
The universal mounting base and pressing plate can be manufactured once and reused across multiple chip applications. This universality reduces manufacturing complexity by eliminating the need to produce customized support structures for each different chip specification.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances adaptability and universality by allowing a single set of mounting and pressing plates to be used with various heat-conducting plates, reducing production complexity and costs, while maintaining effective heat dissipation for chips with different specifications.
Implementation Method 1
heat is dissipated from the chip by circulating liquid inside the heat dissipation apparatus
Implementation Method 2
The heat-conducting plate is used as a main structure of the heat dissipation apparatus, and a liquid channel is disposed on the first surface of the heat-conducting plate
Implementation Method 3
The heat-conducting plate includes a first surface and a second surface that are disposed opposite to each other, the mounting base is configured to bear the heat-conducting plate
Implementation Method 4
The pressing plate is configured to fasten the heat-conducting plate into the accommodation cavity of the mounting base. The pressing plate is detachably connected to the mounting base
Data Source
AI summary
A heat dissipation apparatus includes a heat-conducting plate, where a liquid channel is disposed on a first surface of the heat-conducting plate; a mounting base, where an accommodation cavity configured to accommodate a partial area that is in the heat-conducting plate and that includes a second surface is disposed on the mounting base. The first surface and the second surface are disposed opposite to each other. A pressing plate is configured to fasten the heat-conducting plate in the accommodation cavity. The pressing plate is detachably and firmly connected to the mounting base, a sealing cavity is formed between the pressing plate and the first surface of the heat-conducting plate, and the sealing cavity is configured to accommodate the liquid channel A liquid inlet connector and a liquid outlet connector that are connected to the liquid channel are disposed on the pressing plate.