Modular Cooling Plate Serviceability for Server Leakage Risk
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Solution Overview
Problem
Current server cooling systems face challenges in efficiently managing high heat density and leakages in liquid cooling systems, particularly in compact server packaging, and lack individual electronic card level serviceability, requiring entire chassis removal for maintenance.
Innovation Solution
A modular cooling system with integrated fluid loops and self-mating connectors allows for independent servicing of cooling plates, reducing leakage risks and enhancing reliability, with segregated liquid management and support for single or two-phase cooling liquids.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling systems are used for high performance processors, then cooling efficiency is improved, but leakage risk increases
Solution Approach 1:
The cooling system is divided into modular cooling devices, each corresponding to a specific electronic component or group of components. Each module has its own sealed fluid loop, isolating potential leakage to individual modules rather than the entire system. This segmentation maintains high cooling efficiency while reducing overall leakage risk through compartmentalization.
Solution Approach 2:
Self-mating connectors are introduced as intermediary components between cooling modules and electronic components. These connectors provide sealed interfaces that prevent liquid leakage at connection points while maintaining thermal contact. The self-mating mechanism ensures proper alignment and sealing without manual intervention, reducing leakage risk at critical interface points.
2Volume of moving object
If server packaging is made compact to handle high power density, then space utilization is improved, but leakage locations increase
Solution Approach 1:
The compact server packaging incorporates multiple segmented cooling modules distributed throughout the chassis, each with its own sealed fluid pathway. This segmentation allows dense packing of cooling components while minimizing the number of external connections and potential leakage points. Each module's internal fluid loop is self-contained, reducing vulnerability to leakage even in compact configurations.
Solution Approach 2:
Multiple cooling functions are merged into integrated cooling modules that combine thermal contact surfaces, fluid distribution channels, and connection interfaces in single units. This merging reduces the total number of separate components and connections required, thereby reducing potential leakage locations while maintaining compact server packaging.
3Reliability
If entire chassis is serviced when one electronic card cooling device fails, then system reliability is maintained, but maintenance complexity increases
Solution Approach 1:
The cooling system is segmented into independently serviceable modules, each corresponding to or grouping electronic components. When a cooling device fails, only the specific malfunctioning module needs to be removed and replaced, not the entire chassis. This segmentation dramatically reduces maintenance complexity while preserving system reliability through targeted repairs.
Solution Approach 2:
The faulty cooling module is extracted as a discrete removable unit from the server chassis. The self-mating connectors enable the module to be disconnected and removed without affecting other cooling modules or electronic components. This extraction principle allows maintenance personnel to service individual failed components while leaving the rest of the system operational, reducing maintenance complexity significantly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modular cooling system provides fine-grained serviceability at the individual card level, improving thermal management for high-power density processors, reducing maintenance complexity, and enhancing reliability while maintaining a controlled thermal environment.
Implementation Method 1
Each cooling area of the plurality of cooling areas is to contact with a contacting area of a corresponding cooling plate
Implementation Method 2
The cooling module further comprises an internal cooling loop connected to the main supply connector and the main return connector
Data Source
AI summary
The cooling module comprises a main supply connector, a main return connector, an internal cooling loop, a plurality of cooling plates, a base layer and a lid. The base layer includes a plurality of supply sub-connectors and return sub-connectors and a plurality of cooling areas corresponding to a plurality of cooling plates. Each cooling plate has a supply connector, a return connector and a contacting area. The plurality of supply sub-connectors and return sub-connectors are connected with the internal cooling loop. Each cooling area is to contact with a contacting area of a corresponding cooling plate. Each supply sub-connector is to be connected to a supply connector of the corresponding cooling plate, and each return sub-connector is to be connected to a return connector of the corresponding cooling plate. The corresponding cooling plate is to be removably attached with the base layer and to be serviced independently.