Modular Cooling System for Power Electronics
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Solution Overview
Problem
Current cooling systems for power electronic components face challenges in efficiency, reliability, and cost-effectiveness, particularly when dealing with high power densities and limited space, as well as the need for improved thermal management in two-phase cooling circuits.
Innovation Solution
A modular cooling system comprising separate evaporator and condenser units connected by pipe systems, with electrically insulating portions between condensers to prevent electrical interference, allowing for easy assembly and replacement, and a clamping arrangement to ensure efficient heat transfer and mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If water cooling systems using de-ionized water are used for power electronic devices, then cooling efficiency is improved, but system weight and complexity increase due to required de-ionization units
Solution Approach 1:
The cooling system is divided into multiple independent cooling modules, each with its own evaporator and condenser units. This segmentation allows the system to achieve efficient cooling through distributed two-phase cooling while avoiding the need for a centralized de-ionization unit, thereby reducing overall system weight and complexity.
Solution Approach 2:
The cooling fluid is designed to be self-cooling through natural convection and phase change mechanisms. The system uses the heat dissipation from the power electronic devices themselves to drive the cooling cycle, eliminating the need for external de-ionization equipment and reducing system weight.
2Device complexity
If air cooling is used for power electronic devices, then system simplicity and cost are improved, but cooling efficiency deteriorates due to poor thermo-physical properties of air
Solution Approach 1:
The invention employs liquid cooling fluid in evaporator units to replace air cooling. The liquid phase-change mechanism provides superior heat transfer coefficients compared to air, achieving efficient cooling while maintaining relative system simplicity through the use of straightforward evaporator-condenser modules.
Solution Approach 2:
The cooling system utilizes phase transitions of the cooling fluid (liquid to vapor in evaporators, vapor to liquid in condensers) to achieve highly efficient heat transfer. This phase-change mechanism dramatically improves cooling efficiency compared to air cooling while keeping the system design relatively simple.
3Temperature
If two-phase cooling circuits are used for multiple independent power components, then cooling efficiency is improved, but system reliability and manufacturing cost require improvement
Solution Approach 1:
The system is divided into multiple independent cooling modules, each with its own closed-loop two-phase cooling circuit. This segmentation isolates potential failure points, so that a malfunction in one module does not affect the reliability of other modules, thereby improving overall system reliability while maintaining high cooling efficiency.
Solution Approach 2:
The cooling fluid parameters (pressure, temperature, phase) are optimized for each modular unit to ensure reliable operation. By standardizing these parameters across modules and using robust phase-change mechanisms, the system achieves both high cooling efficiency and improved reliability through consistent, predictable performance.
4Volume of moving object
If power electronic devices are made more compact with higher power densities, then space utilization is improved, but cooling system design complexity and efficiency challenges increase
Solution Approach 1:
The evaporator units are designed to be integrated directly with or adjacent to the power electronic devices, with condenser units positioned in stacked or nested arrangements. This nesting approach allows the cooling system to occupy minimal space while effectively cooling high-power-density devices, reducing design complexity through compact integration.
Solution Approach 2:
The cooling modules are arranged in vertical stacking configurations, utilizing the vertical dimension to accommodate multiple evaporator-condenser pairs in a compact footprint. This dimensional arrangement allows high power density devices to be cooled efficiently without increasing horizontal space requirements, simplifying the overall cooling system design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modular system enhances cooling efficiency, reliability, and cost-effectiveness by allowing individual module adjustments and replacements, maintaining operational integrity even if one module fails, and optimizing heat transfer through transverse coolant flow directions.
Implementation Method 1
an evaporator body for evaporating the cooling fluid by the heat
Implementation Method 2
receiving heat from a corresponding one of the power electronic components
Implementation Method 3
a condenser body for condensing the cooling fluid
Implementation Method 4
at least one coolant medium passageway for an external coolant medium, wherein the at least one coolant medium passageway defines a flow direction for the external coolant medium transverse to the stacking direction
Data Source
Figure 1
Figure 2~3
Figure 4
AI summary
According to the present disclosure, a modular cooling system (10) for cooling a plurality of electronic components (20) is provided. The cooling system comprises a plurality of cooling modules (30) and a clamping arrangement (40). Each cooling module (30) comprises an evaporator unit, a condenser, a first pipe system (70) and a second pipe system (80). The clamping arrangement (40) is adapted for holding and pressing an alternation stack (90) in which the evaporator units (50) are stacked in alternation with the power electronic components (20).