Modular Cooling System With Sealed Media Coupling
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Solution Overview
Problem
Existing cooling systems for electronic circuits with high power losses are inefficient and difficult to maintain, particularly in the automotive field, where they require complex disassembly and long downtimes for component exchange.
Innovation Solution
A modular cooling system with a closed duct system, composed of interchangeable elements, allowing for easy expansion or reduction without losing cooling medium, and enabling quick exchange of electronics modules while maintaining continuous cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional cooling system with integrated power modules is used, then cooling effectiveness is achieved, but system complexity and difficulty of component exchange increase
Solution Approach 1:
The cooling system is divided into separate modular components: a cooling device with cooling medium supply and a power module with power semiconductor components. These modules can be independently exchanged while maintaining the cooling function through standardized connection interfaces.
Solution Approach 2:
The cooling device is designed with universal connection interfaces that can accommodate different power module configurations. The cooling medium supply system serves multiple functions including heat dissipation and module sealing, enabling flexible system adaptation.
2Temperature
If power modules are integrated into a common cooling structure, then cooling performance is improved, but exchange time and system downtime increase
Solution Approach 1:
The power module is separated from the cooling device structure, allowing the power module to be exchanged independently without disassembling the cooling system. The cooling medium supply remains active during module exchange.
Solution Approach 2:
The cooling device is pre-configured with connection interfaces and cooling medium supply pathways that enable rapid module attachment. Sealing elements are pre-positioned to ensure immediate sealing upon module insertion.
3Stability of the object's composition
If a stationary cooling system with fixed dimensions is used, then cooling stability is maintained, but adaptability to different electronic configurations is reduced
Solution Approach 1:
The cooling system transitions from a fixed stationary structure to a dynamic modular configuration. The cooling device maintains stable cooling medium supply while accommodating variable power module arrangements through standardized interfaces.
Solution Approach 2:
The cooling device is designed with universal connection capabilities that support different power module types and configurations while maintaining consistent cooling performance through the common cooling medium supply system.
4Ease of repair
If complete system disassembly is required for module exchange, then thorough maintenance is possible, but operational downtime and complexity increase
Solution Approach 1:
The system is segmented into independently serviceable modules. The power module can be removed and replaced without disassembling the cooling device, allowing maintenance personnel to access and replace power modules while the cooling system remains operational.
Solution Approach 2:
The power module is extracted as a separate serviceable unit from the cooling system. This extraction enables independent maintenance of the power module while the cooling device continues to operate with other modules.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modular cooling system effectively manages high power losses with efficient heat dissipation, allows for flexible and rapid adaptation to changing electronic configurations, and minimizes downtime during maintenance or upgrades.
Implementation Method 1
at least one of the individual modular elements, or all the individual modular elements, can integrally include an electronics unit that is at least indirectly in thermal contact with the partial segment of the at least one cooling duct section
Implementation Method 2
a flow of cooling medium inside the media coupling
Data Source
AI summary
A cooling system having a closed cooling duct system between a main inlet and a main outlet for cooling medium, and includes at least one cooling duct section. The cooling system includes individual modular elements, each including at least one partial segment. In a connecting region of the individual modular elements, their respective at least one partial segment connect continuously to form the at least one cooling duct section. Adjacent individual modular elements each have, in the connecting region, a complementary element of a common media coupling, in which, in a detached connection between two adjacent individual modular elements, the respective partial segment contained in an individual modular element is sealed in media-tight fashion at least in its connecting region, and in a coupled connection between the adjacent individual modular elements, in the connecting region, a passage for a flow of cooling medium is opened inside the media coupling.