Modular Core Module Housing for Flexible Semiconductor Tool Layouts
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Solution Overview
Problem
Existing semiconductor production facilities face limitations in space utilization and flexibility, as machines and devices are typically designed to fit within a predefined space along a transport line, restricting the ability to easily add or modify functionality.
Innovation Solution
A core module for semiconductor production facilities is introduced, comprising a handler, a supply unit, and a control unit, along with a modular housing system of interface frames that can be easily attached or detached to adjust the size and functionality of the module, allowing for the integration of various functionality modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If machines and devices are designed to fit within a predefined space along a transport line, then space utilization is improved, but flexibility and adaptability deteriorate
Solution Approach 1:
The housing is divided into multiple detachable interface frames that can be independently attached or removed. Each interface frame represents a modular segment, allowing the overall housing structure to be reconfigured by adding or removing segments, thus enabling flexible adaptation while maintaining efficient space utilization.
Solution Approach 2:
The housing structure transitions from a fixed, static design to a dynamic, reconfigurable system. The detachable interface frames enable the housing to adapt its configuration based on functional requirements, allowing the system to dynamically adjust its size and layout without requiring complete redesign.
2Area of stationary object
If machines and devices are designed to fit within a predefined space along a transport line, then space utilization is improved, but ease of modification deteriorates
Solution Approach 1:
By segmenting the housing into standardized interface frames with detachable connections, modification becomes a simple matter of adding or removing modules rather than complex manufacturing changes. This segmentation enables rapid reconfiguration and easy adaptation to new functional requirements.
Solution Approach 2:
The standardized interface frames serve multiple functions: they provide structural support, enable detachable connections, and accommodate various functionality modules. This universal design allows the same interface frame structure to be used across different configurations, simplifying modification processes.
3Adaptability or versatility
If the housing is made detachable with multiple interface frames, then flexibility and adaptability are improved, but device complexity increases
Solution Approach 1:
While segmentation increases the number of components, it reduces the complexity of each individual component. Each interface frame is a standardized, relatively simple module that can be mass-produced and easily assembled, making the overall system easier to manage despite having multiple parts.
Solution Approach 2:
The interface frames are designed to connect in a nested or stacked configuration, where simpler modular units combine to form more complex configurations. This nesting approach allows complex functionalities to be achieved through systematic combination of simple, standardized components.
Data Source
AI summary
The invention relates to an apparatus (200, 200A, 300, 400) for a semiconductor production facility handling an object, the apparatus comprising a core module (100) and at least one functionality module (M . . . ). A core module (100) as well as an operating method for such an apparatus are further aspects of the invention.