Modular Cryogenic Cabinet with Independently Cooled Chambers
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Solution Overview
Problem
Existing large-scale cryogenic systems lack modularity and flexibility, limiting the ability to interface and cool multiple payloads without warming up the entire system, and do not allow for independent warming and cooling of individual cryogenic pods.
Innovation Solution
A modular cryogenic system with separate cryogenic chambers connected by a common chamber, allowing independent control and cooling of each chamber, using liquid helium and nitrogen, and incorporating optical and electrical interconnects to maintain cryogenic temperatures while enabling individual pods to be serviced without disrupting the rest of the system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a large-scale cryogenic system is used to cool multiple payloads, then the cooling capacity is sufficient, but the system lacks modularity and flexibility, requiring the entire system to be warmed up for servicing individual pods
Solution Approach 1:
The cryogenic system is divided into multiple independent cryogenic chambers (first cryogenic chamber, second cryogenic chamber, etc.), each capable of being cooled and serviced independently. This segmentation allows individual chambers to be maintained or serviced without affecting other chambers, thereby improving modularity and reducing system downtime.
2Ease of operation
If a single cryogenic chamber is used, then the system is simple to operate, but multiple payloads cannot be serviced independently without warming up the entire system
Solution Approach 1:
Multiple cryogenic chambers are merged into a single integrated system that shares common infrastructure (vacuum enclosure, cooling mechanisms) while maintaining independent operational control. This allows the system to handle multiple payloads with independent control capability, balancing ease of operation with adaptability.
3Productivity
If cryogenic circuits are densely packed to enable high-performance computing, then the computing power increases, but thermal management becomes more challenging
Solution Approach 1:
The system uses multiple separate cryogenic chambers to distribute and manage thermal loads from high-density cryogenic circuits. Each chamber can be independently temperature-controlled, allowing for effective thermal management of high-performance computing workloads while maintaining the necessary cryogenic temperatures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modular system provides enhanced flexibility and control over cryogenic cooling, allowing multiple payloads to be interfaced and serviced independently without affecting the entire system, maintaining cryogenic temperatures and facilitating high-performance computing.
Implementation Method 1
a first channel to circulate a first cryogenic coolant for cooling a first temperature area of the cryogenic cabinet to a first cryogenic temperature
Implementation Method 2
a second channel to circulate a second cryogenic coolant for cooling a second temperature area of the cryogenic cabinet to a second cryogenic temperature, the second cryogenic temperature being colder than the first cryogenic temperature
Implementation Method 3
the thermal shield forming a cryogenic heat buffer between first areas of the plurality of trays and second areas of the plurality of trays such that the cryogenic circuits are maintained at the second cryogenic temperature
Data Source
AI summary
A cryogenic structure can include a cryogenic chamber that houses a plurality of circuits that operate and cryogenic temperatures, and a room temperature portion that houses a plurality of circuits that operate at non-cryogenic temperatures. The circuits can include computer chips, such as electrical or photonic chips, that are housed on movable structures that insertable into the cryogenic structure.