Quantum Processing Circuitry Cooling Systems and Methods
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Solution Overview
Problem
Current quantum processing circuitry architectures are limited by traditional cryocooler designs, which restrict scaling to millions of qubits due to limitations in cooling power and surface area, and require all components to be positioned close to the cryocooler, posing challenges for quantum computers.
Innovation Solution
A modular cryogenic system design with independent pressure chambers and thermal couplings, including cryofluid conduits and heat exchangers, allows quantum processing circuitry components to be positioned at varying distances from the cryocooler, optimizing cooling power and temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional cryocooler design is used, then cooling power is concentrated near the cryocooler, but scaling to millions of qubits is limited due to surface area constraints
Solution Approach 1:
The system divides the quantum processing circuitry into multiple segments distributed across different vacuum chambers, each independently cooled. This segmentation allows scaling beyond the limited surface area near a single cryocooler by adding more chambers and coolers without increasing congestion at the original cooling location.
Solution Approach 2:
The patent transitions from a single-chamber architecture to a multi-chamber architecture, adding the dimension of spatial distribution across separate vacuum chambers. This dimensional change allows quantum components to be positioned in multiple locations while maintaining cryogenic temperatures through independent thermal coupling to coolers in each chamber.
2Loss of energy
If all components are positioned close to the cryocooler, then cooling efficiency is maximized, but device complexity and positioning challenges increase
Solution Approach 1:
Thermal coupling mechanisms act as intermediaries between the coolers and quantum processing components distributed in different vacuum chambers. These thermal couplings transmit cooling efficiently over distances without requiring direct contact, reducing positioning constraints while minimizing cooling loss.
Solution Approach 2:
By distributing components across multiple vacuum chambers with independent coolers, the system removes the constraint of positioning all components near a single cryocooler. Each chamber becomes an independent cooling zone, simplifying the positioning problem by allowing components to be placed optimally within their respective chambers rather than competing for space near one cooling source.
3Reliability
If independent pressure chambers are used, then quantum processing circuitry can operate under optimal vacuum conditions, but system complexity increases
Solution Approach 1:
The system segments quantum processing components into separate vacuum chambers, each maintaining independent pressure conditions optimized for specific quantum operations. This segmentation protects quantum states from environmental interference while allowing different chambers to have different pressure regimes without affecting each other.
Solution Approach 2:
Each vacuum chamber serves multiple functions: maintaining quantum state stability through pressure control, providing thermal coupling to coolers, and housing specific quantum processing components. This multi-functionality reduces overall system complexity by combining what could be separate systems into integrated chamber units.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables scalable quantum computing by optimizing cooling power distribution and temperature control, allowing quantum processing circuitry to operate efficiently at cryogenic conditions.
Implementation Method 1
the quantum processing circuitry being thermally coupled to the cooler
Implementation Method 2
a first heat exchanger within the cooler and configured to receive the cryofluid from the device, cool the cryofluid using the heat exchanger
Data Source
AI summary
Quantum processing circuitry cooling systems are provided. The systems can include a first chamber maintained at a first pressure; a second chamber maintained at a second pressure; a cooler within the first chamber; and quantum processing circuitry within the second chamber, the circuitry being thermally coupled to the cooler. Cooling systems are provided that can include: a cooler configured to generate and/or store cryofluid; a device thermally coupled to the cooler; and a plurality of thermal couplings between the cooler and the device, at least one of the thermal couplings being a first conduit system configured to convey cryofluid between the cooler and the device, wherein the first conduit system includes a first heat exchanger within the cooler and is configured to receive the cryofluid from the device, cool the cryofluid using the heat exchanger and provide cooler cryofluid to the device. Methods for cooling quantum processing circuitry are provided.