Quantum processing circuitry cooling systems and methods
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Solution Overview
Problem
Current cryogenic cooling systems for quantum processing circuitry are limited by traditional architectures that require components to be positioned close to the cryocooler, restricting scalability and efficiency in achieving cryogenic temperatures necessary for quantum technologies, especially for systems with hundreds or millions of qubits.
Innovation Solution
A modular cryogenic cooling system design with independent pressure chambers and thermal links using cryofluid conduits and heat exchangers, allowing quantum processing circuitry to be positioned distant from the cryocooler while maintaining effective cooling through conductive and convective means, utilizing high thermal conductivity materials and controlled cryogenic fluid flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If quantum processing circuitry is positioned close to the cryocooler to maximize conductive cooling power, then cooling efficiency is improved, but device scalability and flexibility are worsened
Solution Approach 1:
The system divides the quantum computing platform into separate modular chambers - a first chamber housing the cryocooler and a second chamber housing the quantum processing circuitry. This segmentation allows each module to be independently optimized and scaled, resolving the contradiction between maintaining cooling efficiency and enabling device scalability.
Solution Approach 2:
A thermal link or heat exchanger acts as an intermediary between the cryocooler in the first chamber and the quantum processing circuitry in the second chamber. This intermediary enables effective heat transfer while allowing physical separation of components, thus maintaining cooling efficiency while improving scalability and flexibility.
2Power
If traditional cryocooler architecture is used with components positioned close to the cooling source, then cooling power is maximized, but system complexity and difficulty of expansion are worsened
Solution Approach 1:
The system separates the cryocooler and quantum processing circuitry into different chambers, creating a modular architecture that reduces system complexity by allowing independent design, testing, and maintenance of each module while maintaining effective thermal coupling through the thermal link.
Solution Approach 2:
The patent transitions from a single-chamber three-dimensional arrangement to a multi-chamber configuration, effectively adding a spatial dimension to the system architecture. This allows the cryocooler and quantum processing circuitry to be optimally positioned in separate locations while maintaining thermal efficiency through the thermal link.
3Adaptability or versatility
If independent pressure chambers are implemented for the cooler and quantum processing circuitry, then operational flexibility and vacuum control are improved, but thermal coupling efficiency is worsened
Solution Approach 1:
A thermal link or heat exchanger serves as a thermal intermediary that bridges the first chamber (housing the cooler) and the second chamber (housing the quantum processing circuitry). This intermediary enables effective heat transfer across the pressure boundary, allowing independent pressure control in each chamber while maintaining thermal coupling efficiency.
Solution Approach 2:
The thermal link may utilize thin-walled conduits or heat exchanger surfaces that provide thermal conductivity while separating the pressure environments of the two chambers. These thin film structures minimize thermal resistance while maintaining pressure isolation, thus resolving the contradiction between pressure control flexibility and thermal coupling efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables scalable and efficient cooling of quantum processing circuitry, optimizing cooling power distribution and temperature control across multiple components, facilitating the development of larger quantum computing systems by decoupling cooling sources from the quantum computer components.
Implementation Method 1
Cryogenic cooling is essential to many quantum technologies including quantum sensing, quantum networking, and quantum computing, where temperatures down to 100 mK are required
Implementation Method 2
a first heat exchanger within the cooler and is configured to receive the cryofluid from the device, cool the cryofluid using the heat exchanger and provide cooler cryofluid to the device
Implementation Method 3
positioning components as close to the cryocooler as possible as to maximize conductive cooling power
Data Source
AI summary
Quantum processing circuitry cooling systems are provided. The systems can include a first chamber maintained at a first pressure; a second chamber maintained at a second pressure; a cooler within the first chamber; and quantum processing circuitry within the second chamber, the circuitry being thermally coupled to the cooler. Cooling systems are provided that can include: a cooler configured to generate and/or store cryofluid; a device thermally coupled to the cooler; and a plurality of thermal couplings between the cooler and the device, at least one of the thermal couplings being a first conduit system configured to convey cryofluid between the cooler and the device, wherein the first conduit system includes a first heat exchanger within the cooler and is configured to receive the cryofluid from the device, cool the cryofluid using the heat exchanger and provide cooler cryofluid to the device. Methods for cooling quantum processing circuitry are provided.