Modular Current Sensor Coil Assembly for Large Openings

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Solution Overview

Problem

Current sensing devices with moderate to large openings are challenging to produce cost-effectively and flexibly, as existing solutions require specific tooling and result in excessive waste, especially when using sheet materials for larger substrates.

Innovation Solution

A modular current sensing device design featuring sensor modules with coil elements mounted on substrate segments and holder structures, utilizing locating pins and retaining holes for precise positioning and stable attachment, allowing for flexible assembly and reduced manufacturing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If a single large substrate is used for moderate to large opening current sensing devices, then the device can accommodate larger conductors, but manufacturing costs increase and material waste becomes excessive

Engineering Contradiction:
Improveopening sizeVSAvoidmanufacturing cost
Core Design Contradiction:
Area of stationary objectVSEase of manufacture

Solution Approach 1:

The device is divided into multiple substrate segments, each carrying a portion of the coil elements. These segments are arranged to form an approximately closed path around the conductor opening. This segmentation allows each substrate to be manufactured separately at lower cost and with less material waste, while still accommodating large conductor openings when assembled together.

Inventive Principle:
Principle #1Segmentation

2Area of stationary object

If a single large substrate is used, then the device can accommodate larger conductors, but material waste increases due to excessive substrate area

Engineering Contradiction:
Improveopening sizeVSAvoidsubstrate waste
Core Design Contradiction:
Area of stationary objectVSLoss of substance

Solution Approach 1:

Instead of using one large substrate that would require excessive material, the substrate is segmented into multiple smaller pieces. Each segment is optimized in size to minimize waste while contributing to the overall closed path structure needed for large opening accommodation.

Inventive Principle:
Principle #1Segmentation

3Area of stationary object

If coil elements are mounted on a single large substrate, then the device can handle larger conductors, but design flexibility decreases

Engineering Contradiction:
Improveopening sizeVSAvoiddesign flexibility
Core Design Contradiction:
Area of stationary objectVSAdaptability or versatility

Solution Approach 1:

The segmented substrate design allows for different configurations and arrangements of coil elements on each segment. This modularity enables greater design flexibility and adaptability for various applications, while still forming the necessary closed path for large conductor openings when the segments are assembled together.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentEP4439082A1Current sensing device
Publication Date: 2024.10.02 ABB (SCHWEIZ) AG
  • EP4439082A1 patent drawingFigure 1
  • EP4439082A1 patent drawingFigure 2
  • EP4439082A1 patent drawingFigure 3

AI summary

The present invention relates to a current sensing device, comprising: - a plurality of sensor modules (400a, 400b, 400n); and - a holder structure (300); wherein each sensor module comprises: - a substrate segment (40a, 40b, 40n); and - one or more coil elements (30); wherein the substrate segment comprises a plurality of retaining holes (100) projecting at least part way through the substrate segment from a first surface of the substrate segment; wherein each coil element comprises: - a winding body (10, 20); - a length of wire (80); and - at least two locating pins (60); wherein the winding body has an outer surface around an axis of the winding body, and wherein at least a portion of the length of wire is wound multiple times around the outer surface of the winding body in a generally circumferential direction with respect to the axis of the winding body; wherein the one or more coil elements of a sensor module are mounted to the first surface of the substrate segment of that sensor module, wherein two locating pins of the at least two locating pins of each coil element are located in two retaining holes of the plurality of retaining holes of the substrate segment; and wherein the plurality of sensor modules are mounted to the holder structure.