Modular Damping Element for Semiconductor Lithography
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Solution Overview
Problem
Mechanical vibrations in projection exposure apparatuses for semiconductor lithography cause impairments in optical imaging quality and yield, exacerbated by changes in process parameters over the apparatus' lifetime, making it difficult to design an optimal damping system for all possible use parameters.
Innovation Solution
A changeable assembly with a damping element that can be rapidly exchanged or introduced into the projection exposure apparatus, allowing for flexible adaptation to changing use parameters, featuring a damping element that can be passive or active, using mass and elastic elements or sensors and actuators to effectively dissipate vibration energy, and optionally incorporating optical elements for additional damping functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a fixed damping system is designed for specific process parameters, then vibration damping performance is optimized for those parameters, but the system cannot adapt to changing process parameters throughout the apparatus lifetime
Solution Approach 1:
The damping system is designed to be dynamically adjustable by replacing damping elements with different characteristics (mass, stiffness, damping coefficient) depending on the process parameters. This allows the system to adapt its damping properties to match varying operational conditions such as different exposure times or advancing speeds, resolving the contradiction between optimized performance for specific parameters and adaptability to changing parameters.
Solution Approach 2:
The invention enables parameter changes in the damping system by providing a set of damping elements with different physical parameters (mass, stiffness, damping coefficients). By selecting and installing the appropriate damping element based on current process parameters, the system maintains optimal vibration damping performance across varying operational conditions without requiring complete system redesign.
2Reliability
If damping elements are permanently installed in the projection objective, then vibration damping is continuously effective, but changing the damping system requires disassembly and takes several days
Solution Approach 1:
The damping system is segmented into modular damping elements that can be independently installed and replaced. Each damping element is designed as a separate component that can be quickly exchanged without disassembling the entire projection objective. This modular approach enables rapid replacement (within 12 hours or less) while maintaining continuous damping functionality, resolving the contradiction between continuous effectiveness and ease of replacement.
Solution Approach 2:
Multiple damping elements with different characteristics are prepared in advance, allowing the operator to select the appropriate element before installation. The damping elements are designed with pre-installed mounting features that align with prepared receptacles in the projection objective, enabling rapid exchange without requiring complex assembly procedures or extended downtime.
3Adaptability or versatility
If multiple damping elements with different characteristics are provided for different process parameters, then adaptability to changing parameters is improved, but the device complexity and inventory requirements increase
Solution Approach 1:
The damping elements are designed with a universal mounting interface that fits into standardized receptacles within the projection objective. Despite having different damping characteristics (mass, stiffness, damping coefficients), all elements share the same installation protocol and physical interface, simplifying the overall system complexity. This universal design allows the system to handle multiple process parameter scenarios without requiring complex configuration procedures or multiple types of mounting mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides increased flexibility and efficiency in damping mechanical vibrations, allowing for rapid adaptation to changing process parameters, reducing downtime, and maintaining optical performance by effectively dissipating vibration energy and maintaining the mechanical properties of the damping element.
Implementation Method 1
a passive damping element comprising a mass element (21) and also an elastic element (22)
Implementation Method 2
a damping element for damping mechanical vibrations
Data Source
AI summary
A changeable assembly for a projection exposure apparatus for semiconductor lithography contains at least one damping element. Projection exposure apparatus for semiconductor lithography and measuring assemblies for a projection exposure apparatus for semiconductor lithography can include at least one sensor for detecting parameters and vibrations of the projection exposure apparatus, wherein the measuring assembly is embodied in such a way that it can be inserted into an exchange opening, provided for an optical element, in the projection exposure apparatus.