Modular Data Center Cooling with Airflow Partitions
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Solution Overview
Problem
Data centers face challenges in efficiently cooling heat-generating electronic devices due to the significant heat produced, which can compromise performance and lead to component failure, and existing cooling systems lack scalability and flexibility to accommodate varying data center sizes and power densities.
Innovation Solution
A modular and scalable data center cooling system comprising a warm air plenum, a cooling module with interchangeable cooling coils, and adjustable airflow partitions, allowing for customizable airflow distribution and integration with structural columns for efficient cooling of heat-generating devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional cooling systems are used in data centers, then cooling function is provided, but the systems lack scalability and flexibility to accommodate varying data center sizes and power densities
Solution Approach 1:
The cooling system is divided into modular cooling units, each comprising a cooling module with evaporator, condenser, and expansion device. These standardized modules can be replicated and configured in different quantities to match varying data center sizes and heat loads, providing scalability without increasing system complexity.
Solution Approach 2:
The cooling modules are designed as universal, multi-functional units that can serve different data center configurations. Each module contains complete refrigeration circuitry and can be deployed independently or in arrays, allowing the same standardized design to adapt to various power densities and spatial arrangements.
2Temperature
If cooling capacity is increased to handle higher power densities, then cooling effectiveness improves, but system complexity and construction time increase
Solution Approach 1:
Instead of installing one large complex cooling system, the solution segments cooling capacity into multiple identical modular units. Each module provides a standardized cooling output, and the total cooling capacity is achieved by deploying the appropriate number of modules, reducing construction time through standardized installation procedures.
Solution Approach 2:
The cooling modules are pre-assembled with complete refrigeration circuits, controls, and connections during manufacturing. This preliminary assembly allows for rapid deployment in the data center environment, reducing on-site construction time while maintaining full cooling effectiveness.
3Adaptability or versatility
If modular components are used to improve scalability, then flexibility increases, but device complexity may increase
Solution Approach 1:
The system segments cooling functionality into discrete, identical modules rather than using a single complex integrated system. This segmentation provides flexibility to configure different numbers of modules while each individual module maintains simple, standardized internal architecture, preventing overall system complexity from increasing.
Solution Approach 2:
The modular design allows flexibility through parameter changes in the number of modules deployed rather than through complexity changes in individual module design. Each module maintains fixed, simple parameters while system-level flexibility is achieved by varying the quantity of identical units.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides efficient cooling for data centers of varying sizes, reduces construction time, and allows for flexible power and cooling capacity adjustments, enhancing operational efficiency and cost-effectiveness by utilizing modular components.
Implementation Method 1
a cooling module positioned in the ceiling space and including at least one cooling coil... circulating the warmed airflow... through the cooling module to cool the warmed airflow
Implementation Method 2
a fan positioned in the ceiling space... to circulate the warmed airflow from the one or more racks, through the warmed air plenum, into the ceiling space
Data Source
Figure 1A
Figure 1B
Figure 2
AI summary
Techniques for cooling a data center include circulating an airflow, to a warm air plenum of a first module, from rows of racks that support a heat-generating electronic devices; warming the airflow circulated through the racks; circulating the warmed airflow through a warm air inlet of the warm air plenum that is adjacent an open side of the racks and to a warmed air outlet adjacent a data center volume above the racks; circulating the airflow, with a fan positioned in a second module positioned in the data center volume above the racks, through at least one cooling module to cool the warmed airflow, and into a human-occupiable workspace of the data center adjacent the racks; and diverting the warmed airflow with an airflow partition mounted in the data center volume above the racks and adjusted to interrupt the warmed airflow between the warmed air plenum and the human-occupiable workspace.