Modular Data Center Cooling System with Roller Assembly
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Solution Overview
Problem
Data centers face challenges in efficiently cooling heat-generating electronic devices due to the high power consumption and heat production, which can lead to performance degradation and component failure if temperatures exceed certain limits, and existing cooling systems may not be scalable or efficient for varying data center sizes and configurations.
Innovation Solution
A modular data center cooling system comprising upper and lower modules with air conditioning units, roller assemblies for movement, and a scalable design that includes air conditioning modules with cooling coils, fans, and energy recovery ventilators, allowing for efficient airflow management and power distribution, enabling flexible deployment and scalability from small to large data centers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional cooling systems are used in data centers, then cooling function is provided, but the systems are not scalable and efficient for varying data center sizes and configurations
Solution Approach 1:
The cooling system is divided into modular units that can be independently configured and scaled. Each module contains integrated cooling components (air handlers, cooling coils, fans) that can be assembled in different quantities and arrangements to match various data center sizes and thermal loads, enabling scalable deployment without redesigning the entire system.
Solution Approach 2:
The modular cooling modules are designed with universal interfaces and standardized components that can serve multiple data center configurations. The same basic module type can be deployed in small, medium, and large data centers by simply replicating and connecting multiple units, providing adaptability across varying scales without requiring specialized designs for each size category.
2Power
If computer related components operate at high power, then computing performance is improved, but heat generation increases causing performance degradation and component failure
Solution Approach 1:
The system introduces conditioned air as an intermediary cooling medium that is pre-cooled by dedicated cooling coils before being supplied to heat-generating electronic components. This intermediary cooled air absorbs heat from the components more efficiently than ambient air, enabling higher power operation while maintaining safe component temperatures through enhanced heat transfer.
Solution Approach 2:
The system replaces traditional mechanical liquid cooling infrastructure with a streamlined air-based cooling approach using evaporative cooling and heat exchanger coils. This substitution eliminates complex pumps, pipes, and liquid handling mechanisms while achieving effective heat removal through phase change and thermal conduction in the air cooling system.
3Adaptability or versatility
If modular design is implemented, then scalability and flexibility are improved, but manufacturing and assembly complexity increases
Solution Approach 1:
Multiple cooling functions (air intake, filtration, cooling, fan drive, and air distribution) are merged into single integrated modules. Each module combines several components that work together as a unified unit, reducing the total number of separate assemblies required and simplifying the overall manufacturing process while maintaining modular scalability.
Solution Approach 2:
Components are nested within modules in a hierarchical structure where smaller components (motors, coils, filters) are contained within larger module assemblies. This nesting approach allows for efficient packaging, simplified handling, and standardized manufacturing of complete functional units that can be easily deployed and scaled.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modular system provides efficient cooling and power distribution, allowing for scalable and flexible data center configurations, reducing construction time and costs, improving safety, and enabling limitless bidirectional scalability, while minimizing dependency on local labor and optimizing fabrication quality.
Implementation Method 1
a cooling coil configured to cool the air stream and condense water vapor from the air stream
Implementation Method 2
an evaporative pad positioned downwind of the cooling coil and configured to receive the air stream from the cooling coil and evaporatively cool the air stream
Implementation Method 3
a fan positioned upstream of the evaporative pad and configured to move an air stream through the modular data center system
Data Source
AI summary
A modular data center system includes an upper module including a roller assembly attached to a frame of the upper module, the roller assembly configured to engage at least a portion of a rail assembly attached to a structure of a data center building; and a lower module attachable to the upper module and configured to suspend above a floor of a human-occupiable workspace of the data center that supports a plurality of racks including a plurality of heat-generating electronic devices, the lower module including a power support assembly configured to provide electrical power to the plurality of heat-generating electronic devices.