Modular Data Center Interfaces for Unified Mechanical, Electrical, Airflow

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Solution Overview

Problem

Heterogeneous data center environments face challenges in scalability and resource-intensive engineering due to the need for compatible mechanical, electrical, and airflow connections between various cooling, power, and IT components, which are often available only in one-size-fits-all or custom configurations.

Innovation Solution

A pairing methodology is provided to install compatible mechanical, electrical, and airflow connections between modular data center components, minimizing resource-intensive efforts by using standardized interfaces and modular structures that allow for flexible and efficient assembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If commercial one-size-fits-all components are used, then device complexity is reduced, but adaptability to heterogeneous data center environments deteriorates

Engineering Contradiction:
Improvecomponent configuration complexityVSAvoidadaptability to heterogeneous environments
Core Design Contradiction:
Device complexityVSAdaptability or versatility

Solution Approach 1:

The patent implements universal connection interfaces that can accommodate multiple component types and configurations. The standardized mechanical, electrical, and airflow interfaces are designed to work with diverse cooling, power, and IT components, allowing a single interface design to serve multiple functions and component varieties, thereby achieving both simplicity and adaptability

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If custom solutions are provided for specific customer demands, then adaptability to heterogeneous environments is improved, but device complexity and resource-intensive engineering increase

Engineering Contradiction:
Improveadaptability to customer demandsVSAvoidengineering resource requirements
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent segments the connection interface into distinct modular components: mechanical connection elements, electrical connection elements, and airflow connection elements. This segmentation allows each component to be independently designed and configured for specific customer needs while maintaining standardized interfaces, reducing overall engineering complexity through modular customization

Inventive Principle:
Principle #1Segmentation

3Adaptability or versatility

If custom solutions are provided for specific customer demands, then adaptability to heterogeneous environments is improved, but productivity and scalability deteriorate

Engineering Contradiction:
Improvecustom configuration capabilityVSAvoiddeployment scalability
Core Design Contradiction:
Adaptability or versatilityVSProductivity

Solution Approach 1:

The patent incorporates preliminary design considerations by pre-configuring standardized connection interfaces that anticipate various customer requirements. The interfaces are designed in advance to support multiple component types and configurations, eliminating the need for custom engineering during deployment and enabling rapid scalability

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS12369269B2Module-to-module mechanical, electrical, and airflow connections in modular data centers
Publication Date: 2025.07.22 DELL PROD LP
  • US12369269B2 patent drawing
  • US12369269B2 patent drawing
  • US12369269B2 patent drawing

AI summary

A modular data center includes: a modular information technology component (MITC), in which the MITC includes a plurality of information handling systems (IHSs), a utility control component (UCC), and a first connection interface, in which the first connection interface includes a first set of mechanical and electrical connection components (MECCOMs); and a modular environmental control component (MECC), in which the MECC includes a plurality of environmental control components (ECCs) and a second connection interface, in which the second connection interface includes a second set of MECCOMs to be paired with the first set of MECCOMs to generate at least a portion of the modular data center, and in which the first connection interface is connected to the second connection interface, in which an area enclosed by the first connection interface is equal to an area enclosed by the second connection interface.