Modular Data Center With Submerged Heat Sinks for Passive Cooling

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Solution Overview

Problem

Conventional data centers face high costs and infrastructure requirements due to the need for massive cooling systems to maintain optimal operating temperatures for computer systems, which generate substantial heat during operation.

Innovation Solution

A modular data center design featuring a submersible structure with heat sinks that utilize a fluid-based cooling system, where heat sinks are submerged in a fluid to dissipate heat efficiently, reducing the need for expensive cooling infrastructure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional air conditioning systems are used for cooling, then the operating temperature can be maintained, but the infrastructure cost and complexity increase significantly

Engineering Contradiction:
Improveoperating temperatureVSAvoidcooling infrastructure
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent extracts the cooling function from complex conventional air conditioning systems and implements it through simple heat sinks that passively dissipate heat into the surrounding environment, eliminating the need for compressors, condensers, and expansion valves

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The heat sinks operate autonomously without requiring external power or complex control systems, utilizing natural convection and radiation to dissipate heat from the servers directly into the environment

Inventive Principle:
Principle #25Self-service

2Temperature

If closed loop fluid cooling systems are used, then heat can be managed efficiently, but the system becomes expensive and resource-intensive

Engineering Contradiction:
Improveheat managementVSAvoidcooling fluid
Core Design Contradiction:
TemperatureVSQuantity of substance

Solution Approach 1:

The patent removes the closed loop fluid circulation system and replaces it with open heat sinks that dissipate heat directly into the environment, eliminating the need for pumping fluids through tubes and channels

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The heat sinks are designed as simple, inexpensive components that can be easily replaced if needed, rather than investing in expensive closed loop fluid systems that require maintenance of the fluid circulation infrastructure

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

3Temperature

If massive cooling systems are deployed, then the operating temperature range can be maintained, but the operational cost increases

Engineering Contradiction:
Improveoperating temperature rangeVSAvoidcooling energy consumption
Core Design Contradiction:
TemperatureVSUse of energy by moving object

Solution Approach 1:

The heat sinks utilize natural physical processes (convection and radiation) to dissipate heat without requiring external energy input, eliminating the need for powered compressors and pumps that consume significant energy

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The patent replaces mechanical cooling systems (compressors, condensers, expansion valves) with passive thermal dissipation through heat sinks, substituting mechanical energy consumption with natural thermal processes

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively manages heat dissipation with minimal environmental impact, maintaining optimal operating temperatures for electronic IT equipment while reducing cooling costs and infrastructure needs.

Implementation Method 1

heat sinks that utilize a fluid-based cooling system, where heat sinks are submerged in a fluid to dissipate heat efficiently

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

heat sinks are submerged in a fluid to dissipate heat efficiently, reducing the need for expensive cooling infrastructure

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS8854809B2Modular data center
Publication Date: 2014.10.07 HEWLETT PACKARD ENTERPRISE DEV LP
  • US8854809B2 patent drawing
  • US8854809B2 patent drawing
  • US8854809B2 patent drawing

AI summary

A data center includes a modular building structure forming an enclosure having a bottom side. An external support system extends from the modular building structure. A series of heat sinks are each configured to extend from an interior to an exterior of the enclosure and protrude below the bottom side of the modular building structure into a fluid. Electronic components and devices are housed within the enclosure.